國立高雄大學圖資館 |

Language: English

Back

The effects of multi-dimensional constraint on the adhesion of thin-films and patterned structures

Record Type:	Electronic resources : Monograph/item
Title/Author:	The effects of multi-dimensional constraint on the adhesion of thin-films and patterned structures
Author:	Litteken, Christopher S.
Description:	157 p.
Notes:	Adviser: Reinhold Dauskardt.
Notes:	Source: Dissertation Abstracts International, Volume: 65-04, Section: B, page: 2045.
Contained By:	Dissertation Abstracts International65-04B.
Subject:	Engineering, Materials Science.
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3128669
ISBN:	0496759310

The effects of multi-dimensional constraint on the adhesion of thin-films and patterned structures
Litteken, Christopher S.

The effects of multi-dimensional constraint on the adhesion of thin-films and patterned structures [electronic resource] - 157 p.

Adviser: Reinhold Dauskardt.

Thesis (Ph.D.)--Stanford University, 2004.

Results from blanket film structures indicated the adhesive characteristics of an interface were dominated by plastic energy dissipated within adjacent polymer or metal layers. Due to the constraint provided by the neighboring elastic layers or the relatively massive substrate, the extent of plastic deformation was observed to be dependent on the ductile film's thickness and residual stress. In patterned structures containing lithographically defined low-k polymer lines where the line width varied between 2 mum and 12 mum, a 50% increase in Gc was observed for the smallest feature width compared to a similar blanket polymer film interface. This behavior was rationalized in terms of the effect of stress state on the local fracture mode and resulting plastic deformation in the polymer line, similar to the plane stress to plane strain transition observed in bulk materials.

ISBN: 0496759310Subjects--Topical Terms:

226940
Engineering, Materials Science.

The effects of multi-dimensional constraint on the adhesion of thin-films and patterned structures
LDR:03463nmm _2200301 _450 001 162645
005 20051017073508.5
008 230606s2004 eng d
020 $a 0496759310
035 $a 00149146
035 $a 162645
040 $a UnM $c UnM
100 0 $a Litteken, Christopher S. $3 227789
245 1 4 $a The effects of multi-dimensional constraint on the adhesion of thin-films and patterned structures $h [electronic resource]
300 $a 157 p.
500 $a Adviser: Reinhold Dauskardt.
500 $a Source: Dissertation Abstracts International, Volume: 65-04, Section: B, page: 2045.
502 $a Thesis (Ph.D.)--Stanford University, 2004.
520 # $a Results from blanket film structures indicated the adhesive characteristics of an interface were dominated by plastic energy dissipated within adjacent polymer or metal layers. Due to the constraint provided by the neighboring elastic layers or the relatively massive substrate, the extent of plastic deformation was observed to be dependent on the ductile film's thickness and residual stress. In patterned structures containing lithographically defined low-k polymer lines where the line width varied between 2 mum and 12 mum, a 50% increase in Gc was observed for the smallest feature width compared to a similar blanket polymer film interface. This behavior was rationalized in terms of the effect of stress state on the local fracture mode and resulting plastic deformation in the polymer line, similar to the plane stress to plane strain transition observed in bulk materials.
520 # $a Successful integration of new materials, such as advanced low- k dielectrics, into high-density interconnect structures within microelectronic devices requires an understanding of the mechanisms that control the adhesion of thin-film interfaces. The intent of the present study is to investigate the role of multi-dimensional elastic constraint on the mechanical and interfacial properties of lithographically patterned thin-film structures. Accordingly, structures comprised of metal and low-k films were fabricated to systematically vary in either one dimension (blanket film thickness) or two dimensions (patterned feature aspect ratio). Fracture mechanics techniques were employed to measure the critical interfacial adhesion (G c) at the relevant blanket or patterned film interface.
520 # $a To investigate more technologically relevant patterned structures, arrays of alternating Cu and low-k lines were fabricated with feature widths varying between 0.2 mum and 3 mum. A pronounced increase in Gc was observed when the debond was propagated orthogonal, rather than parallel, to the length of the line. Morphological characterization of the fracture surface revealed features with a pitch and orientation identical to the original patterned structures, resulting from variations in elastic properties adjacent to the debonded interface. Mechanics models detailing crack tip shielding and energy dissipation through the frictional contact of these surface asperities were developed to explain the observed trends in adhesion.
590 $a School code: 0212.
650 # 0 $a Engineering, Materials Science. $3 226940
650 # 0 $a Engineering, Mechanical. $3 212470
690 $a 0548
690 $a 0794
710 0 # $a Stanford University. $3 212607
773 0 # $g 65-04B. $t Dissertation Abstracts International
790 $a 0212
790 1 0 $a Dauskardt, Reinhold, $e advisor
791 $a Ph.D.
792 $a 2004
856 4 0 $u http://libsw.nuk.edu.tw/login?url=http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3128669 $z http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3128669