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Materials for Information Technology :Devices, Interconnects and Packaging /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Materials for Information Technology :edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick.
Reminder of title:	Devices, Interconnects and Packaging /
other author:	Zschech, Ehrenfried.
corporate name:
Published:	London :Springer-Verlag London Limited,2005.
Description:	v.: digital
Series:	Engineering Materials and Processes,
Subject:	Ceramics, Glass, Composites, Natural Methods
Online resource:	http://dx.doi.org/10.1007/1-84628-235-7
ISBN:	9781846282355 (electronic bk.)

Materials for Information Technology :Devices, Interconnects and Packaging /
Materials for Information Technology :Devices, Interconnects and Packaging /[electronic resource] :edited by Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick. - London :Springer-Verlag London Limited,2005. - v.: digital - Engineering Materials and Processes,1619-0181.

ISBN: 9781846282355 (electronic bk.)Subjects--Topical Terms:

253474
Ceramics, Glass, Composites, Natural Methods

LC Class. No.: TK7874 / .E75 2003

Dewey Class. No.: 621.381

Materials for Information Technology :Devices, Interconnects and Packaging /
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650 # 0 $a Surfaces and Interfaces, Thin Films $3 252499
650 # 0 $a Electronics and Microelectronics, Instrumentation $3 252956
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