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Bonding in Microsystem Technology /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Bonding in Microsystem Technology /by Jan A. Dziuban.
作者:	Dziuban, Jan A..
出版者:	Dordrecht :Springer,2006.
面頁冊數:	v.: digital
叢書名:	Springer Series in Advanced Microelectronics, ;
標題:	Operating Procedures, Materials Treatment
電子資源:	http://dx.doi.org/10.1007/1-4020-4589-1
ISBN:	9781402045783 (paper)

Bonding in Microsystem Technology /
Dziuban, Jan A..

Bonding in Microsystem Technology /[electronic resource] /by Jan A. Dziuban. - Dordrecht :Springer,2006. - v.: digital - Springer Series in Advanced Microelectronics, ;24,1437-0387 ;.

ISBN: 9781402045783 (paper)Subjects--Topical Terms:

254653
Operating Procedures, Materials Treatment

LC Class. No.: TK7874 / .D95 2006

Dewey Class. No.: 620.5

Bonding in Microsystem Technology /
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650 # 0 $a Physics and Applied Physics in Engineering $3 252550
650 # 0 $a Continuum Mechanics and Mechanics of Materials $3 252792
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