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Bonding in Microsystem Technology /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Bonding in Microsystem Technology /by Jan A. Dziuban.
Author:	Dziuban, Jan A..
Published:	Dordrecht :Springer,2006.
Description:	v.: digital
Series:	Springer Series in Advanced Microelectronics, ;
Subject:	Operating Procedures, Materials Treatment
Online resource:	http://dx.doi.org/10.1007/1-4020-4589-1
ISBN:	9781402045783 (paper)

Bonding in Microsystem Technology /
Dziuban, Jan A..

Bonding in Microsystem Technology /[electronic resource] /by Jan A. Dziuban. - Dordrecht :Springer,2006. - v.: digital - Springer Series in Advanced Microelectronics, ;24,1437-0387 ;.

ISBN: 9781402045783 (paper)Subjects--Topical Terms:

254653
Operating Procedures, Materials Treatment

LC Class. No.: TK7874 / .D95 2006

Dewey Class. No.: 620.5

Bonding in Microsystem Technology /
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020 $a 9781402045899 (electronic bk.)
035 $a 00287390
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082 0 0 $2 22 $a 620.5
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100 0 $a Dziuban, Jan A.. $3 260563
245 1 0 $a Bonding in Microsystem Technology / $c by Jan A. Dziuban. $h [electronic resource] /
260 # $a Dordrecht : $c 2006. $b Springer,
300 $b v.: digital
440 0 $a Springer Series in Advanced Microelectronics, ; $v 24, $x 1437-0387 ;
650 # 0 $a Operating Procedures, Materials Treatment $3 254653
650 # 0 $a Engineering $3 252507
650 # 0 $a Optical materials $3 252496
650 # 0 $a Electronics $3 252955
650 # 0 $a Materials $3 252605
650 # 0 $a Structural control (Engineering) $3 204897
650 # 0 $a Optical and Electronic Materials $3 252498
650 # 0 $a Electronics and Microelectronics, Instrumentation $3 252956
650 # 0 $a Physics and Applied Physics in Engineering $3 252550
650 # 0 $a Continuum Mechanics and Mechanics of Materials $3 252792
856 4 0 $u http://libsw.nuk.edu.tw/login?url=http://dx.doi.org/10.1007/1-4020-4589-1 $z http://dx.doi.org/10.1007/1-4020-4589-1
950 $a Engineering (Springer-11647; ZDB-2-ENG)

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1 records • Pages 1 •
1

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000000006037

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1圖書

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EB TK7874 D999 2006

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1 records • Pages 1 •
1

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http://libsw.nuk.edu.tw/login?url=http://dx.doi.org/10.1007/1-4020-4589-1

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