Low thermal budget processing for se...
Rajendran, Bipin.

 

  • Low thermal budget processing for sequential three dimensional integrated circuit fabrication.
  • 紀錄類型: 書目-電子資源 : Monograph/item
    正題名/作者: Low thermal budget processing for sequential three dimensional integrated circuit fabrication.
    作者: Rajendran, Bipin.
    面頁冊數: 95 p.
    附註: Adviser: R. Fabian W. Pease.
    附註: Source: Dissertation Abstracts International, Volume: 67-09, Section: B, page: 5296.
    Contained By: Dissertation Abstracts International67-09B.
    標題: Engineering, Electronics and Electrical.
    電子資源: http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3235327
    ISBN: 9780542895425
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