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Introduction to system-on-package (S...
~
Swaminathan, Madhavan.
Introduction to system-on-package (SOP) :miniaturization of the entire system /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Introduction to system-on-package (SOP) :Rao R. Tummala, Madhavan Swaminathan.
Reminder of title:
miniaturization of the entire system /
Author:
Tummala, Rao R.,
other author:
Swaminathan, Madhavan.
Published:
New York :McGraw-Hill,c2008.
Description:
xx, 785 p. :ill. ;25 cm.
Subject:
Multichip modules (Microelectronics)Design and construction.
ISBN:
0071459065 (alk. paper) :
Introduction to system-on-package (SOP) :miniaturization of the entire system /
Tummala, Rao R.,1942-
Introduction to system-on-package (SOP) :
miniaturization of the entire system /Rao R. Tummala, Madhavan Swaminathan. - New York :McGraw-Hill,c2008. - xx, 785 p. :ill. ;25 cm.
Includes bibliographical references and index.
ISBN: 0071459065 (alk. paper) :NT$2160
LCCN: 2008016996Subjects--Topical Terms:
185545
Multichip modules (Microelectronics)
--Design and construction.
LC Class. No.: TK7870.15 / T925 2008
Dewey Class. No.: 621.381/046
Introduction to system-on-package (SOP) :miniaturization of the entire system /
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Introduction to system-on-package (SOP) :
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miniaturization of the entire system /
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Rao R. Tummala, Madhavan Swaminathan.
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c2008.
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McGraw-Hill,
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xx, 785 p. :
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ill. ;
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25 cm.
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Includes bibliographical references and index.
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Multichip modules (Microelectronics)
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Design and construction.
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185545
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Microelectronic packaging.
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182088
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Swaminathan, Madhavan.
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306904
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西方語文圖書區(四樓)
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TK7870.15 T925 2008
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1 records • Pages 1 •
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