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Materials for advanced packaging
~
Lu, Daniel.
Materials for advanced packaging
Record Type:
Electronic resources : Monograph/item
Title/Author:
Materials for advanced packagingedited by Daniel Lu, C.P. Wong.
other author:
Wong, C.P.
Published:
Boston, MA :Springer US,2009.
Description:
xii, 316 p. :ill., digital ;24 cm.
Contained By:
Springer eBooks
Subject:
PackagingMaterials.
Online resource:
http://dx.doi.org/10.1007/978-0-387-78219-5
ISBN:
9780387782195 (electronic bk.)
Materials for advanced packaging
Materials for advanced packaging
[electronic resource] /edited by Daniel Lu, C.P. Wong. - Boston, MA :Springer US,2009. - xii, 316 p. :ill., digital ;24 cm.
ISBN: 9780387782195 (electronic bk.)Subjects--Topical Terms:
338502
Packaging
--Materials.
LC Class. No.: TK7874 / .M38 2009
Dewey Class. No.: 621.381046
Materials for advanced packaging
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Materials for advanced packaging
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[electronic resource] /
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edited by Daniel Lu, C.P. Wong.
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Boston, MA :
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2009.
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Springer US,
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xii, 316 p. :
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ill., digital ;
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24 cm.
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Packaging
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Materials.
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338502
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Microelectronic packaging.
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Material Science.
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Electronics and Microelectronics, Instrumentation.
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Wong, C.P.
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Lu, Daniel.
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http://dx.doi.org/10.1007/978-0-387-78219-5
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Chemistry and Materials Science (Springer-11644; ZDB-2-CMS)
based on 0 review(s)
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1 records • Pages 1 •
1
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Attachments
000000028046
電子館藏
1圖書
電子書
EB TK7874 M425 2009
一般使用(Normal)
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0
1 records • Pages 1 •
1
Multimedia
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http://dx.doi.org/10.1007/978-0-387-78219-5
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