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Copper interconnect technology

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Gupta, Tapan.

Copper interconnect technology

Record Type:	Electronic resources : Monograph/item
Title/Author:	Copper interconnect technologyby Tapan Gupta.
Author:	Gupta, Tapan.
Published:	New York, NY :Springer Science+Business Media, LLC,2009.
Description:	xix, 423 p. :ill., digital ;25 cm.
Contained By:	Springer eBooks
Subject:	Interconnects (Integrated circuit technology)
Online resource:	http://dx.doi.org/10.1007/978-1-4419-0076-0
ISBN:	9781441900760 (electronic bk.)

Copper interconnect technology
Gupta, Tapan.

Copper interconnect technology[electronic resource] /by Tapan Gupta. - New York, NY :Springer Science+Business Media, LLC,2009. - xix, 423 p. :ill., digital ;25 cm.

ISBN: 9781441900760 (electronic bk.)Subjects--Topical Terms:

224341
Interconnects (Integrated circuit technology)

LC Class. No.: TK7874.53 / .G878 2009

Dewey Class. No.: 621.38152

Copper interconnect technology
LDR:00731nmm 2200229 a 4500 001 245457
003 Springer
005 20100412162627.0
006 m d
007 cr nn 008maaau
008 100505s2009 nyu s j eng d
020 $a 9781441900760 (electronic bk.)
020 $a 9781441900753 (paper)
035 $a 978-1-4419-0075-3
050 0 4 $a TK7874.53 $b .G878 2009
082 0 4 $a 621.38152 $2 22
090 $a TK7874.53 $b .G977 2009
100 1 $a Gupta, Tapan. $3 225085
245 1 0 $a Copper interconnect technology $h [electronic resource] / $c by Tapan Gupta.
260 $a New York, NY : $b Springer Science+Business Media, LLC, $c 2009.
300 $a xix, 423 p. : $b ill., digital ; $c 25 cm.
650 0 $a Interconnects (Integrated circuit technology) $3 224341
650 0 $a Microelectronics. $3 182484
650 0 $a Copper. $3 389158
650 2 4 $a Nanotechnology. $3 193873
650 2 4 $a Circuits and Systems. $3 274416
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
650 2 4 $a Optical and Electronic Materials. $3 274099
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-1-4419-0076-0
950 $a Engineering (Springer-11647)

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000000036959

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EB TK7874.53 G977 2009

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http://dx.doi.org/10.1007/978-1-4419-0076-0

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