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Wire bonding in microelectronics
Record Type:
Electronic resources : Monograph/item
Title/Author:
Wire bonding in microelectronicsGeorge G. Harmon.
Author:
Harman, George G.
other author:
Harman, George G.
Published:
New York :McGraw-Hill,c2010.
Description:
xx, 426 p. :ill. microelectronics. 1989.
Subject:
Wire bonding (Electronic packaging)Production control.
Online resource:
Click for full text (McGrawHill)
ISBN:
9780071476232
Wire bonding in microelectronics
Harman, George G.
Wire bonding in microelectronics
[electronic resource] /George G. Harmon. - 3rd ed. - New York :McGraw-Hill,c2010. - xx, 426 p. :ill. microelectronics. 1989.
ISBN: 9780071476232
LCCN: 2010287045Subjects--Topical Terms:
182758
Wire bonding (Electronic packaging)
--Production control.Index Terms--Genre/Form:
214472
Electronic books.
LC Class. No.: TK7836 / .H366 2010
Dewey Class. No.: 621.381
Wire bonding in microelectronics
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http://taebcmgh.sa.libraryandbook.net/FE/advanceSearch.do?method=toView&id=YsdsdebY1871214aY
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Click for full text (McGrawHill)
based on 0 review(s)
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EB TK7836 .H366 2010 c2010
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http://taebcmgh.sa.libraryandbook.net/FE/advanceSearch.do?method=toView&id=YsdsdebY1871214aY
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