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應用田口方法改善覆晶封裝碑立問題之研究 = The Study of I...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

應用田口方法改善覆晶封裝碑立問題之研究 = The Study of Improvement of Tombstone in Flip Chip Package with Taguchi Method

Record Type:	Language materials, printed : monographic
Paralel Title:	The Study of Improvement of Tombstone in Flip Chip Package with Taguchi Method
Author:	莊文源,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	民99[2010]
Description:	60面圖，表 : 30公分;
Subject:	表面粘著技術
Subject:	Surface Mount Technology
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/89895431960300162287
Summary:	本研究所探討的是針對目前IC封裝中的覆晶產品結合表面黏著技術所產生被動元件碑立問題，利用田口方法分析影響的主要因子與最佳水準組合，並經驗證實驗得到較薄的鋼板厚度搭配較小的錫膏顆粒較能夠有完整的印刷形狀，並對置件後被動元件置放也較穩定。 This study is focused on solving the tombstone issue of surface mount technology in current flip chip assembly process. Taguchi methodology is used to get the optimal design and is verified by experiments. The result concludes that the thinner stencil thickness and the smaller solder paste particle have stable performance in the solder printing shape and the placement.

應用田口方法改善覆晶封裝碑立問題之研究 = The Study of Improvement of Tombstone in Flip Chip Package with Taguchi Method
莊, 文源

應用田口方法改善覆晶封裝碑立問題之研究 = The Study of Improvement of Tombstone in Flip Chip Package with Taguchi Method / 莊文源撰 - [高雄市] : 撰者, 民99[2010]. - 60面 ; 圖，表 ; 30公分.
參考書目：面.
表面粘著技術Surface Mount Technology

應用田口方法改善覆晶封裝碑立問題之研究 = The Study of Improvement of Tombstone in Flip Chip Package with Taguchi Method
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328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
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