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凸塊迴焊製程技術之錫球孔洞改進研究 = The Study of the...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

凸塊迴焊製程技術之錫球孔洞改進研究 = The Study of the Bump Void Improvement for Solder Bump Reflow Process

Record Type:	Language materials, printed : monographic
Paralel Title:	The Study of the Bump Void Improvement for Solder Bump Reflow Process
Author:	王保揚,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	民99[2010]
Description:	69面圖，表 : 30公分;
Subject:	覆晶封裝
Subject:	Flip Chip Assembly
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/07160271743927416955
Summary:	凸塊封裝技術中，網板印刷法為主要製程方法。但網版印刷法對於在微小的凸塊中容易出現空孔的現象，於後製程覆晶封裝接合製程中，容易產生錫球斷裂或偏移等可靠性的影響。本論文根據銲錫合金相圖原理，探討凸塊迴焊製程中，合金的共熔狀態及升溫、降溫曲線對凸塊空孔的形成之影響，並找出控制凸塊空孔的最佳化製程條件。 Since screen printing has advantages of mass production and low cost, it is the popular solder bump process. The Solder Bump is a connector on the UBM (Under Bump Metallurgy) in Wafer Bump assembly process. It usually is produced by solder plating or solder printer process, however the void appear in the fine scale solder bump in screen printing process, cause bump break and shift moving in the Flip Chip process. For this study, we will explore in screen printing process, the effect of parameters in reflow process such as heating/cooling curve, improve solder bump process to the formative of the bump voids. As a result, by control way the heating/cooling curve property, we can improve the solder bump failure rate and improve the yield of the screen print process. It is found that the maximum heating temperature should be set to higher than the eutectic temperature of Pb/Sn alloy, and a minimum cooling rate is necessary for the transfer motion from liquid to solid phase at equilibrium state.

凸塊迴焊製程技術之錫球孔洞改進研究 = The Study of the Bump Void Improvement for Solder Bump Reflow Process
王, 保揚

凸塊迴焊製程技術之錫球孔洞改進研究 = The Study of the Bump Void Improvement for Solder Bump Reflow Process / 王保揚撰 - [高雄市] : 撰者, 民99[2010]. - 69面 ; 圖，表 ; 30公分.
參考書目：面.
覆晶封裝Flip Chip Assembly

凸塊迴焊製程技術之錫球孔洞改進研究 = The Study of the Bump Void Improvement for Solder Bump Reflow Process
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328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
330 $a 凸塊封裝技術中，網板印刷法為主要製程方法。但網版印刷法對於在微小的凸塊中容易出現空孔的現象，於後製程覆晶封裝接合製程中，容易產生錫球斷裂或偏移等可靠性的影響。本論文根據銲錫合金相圖原理，探討凸塊迴焊製程中，合金的共熔狀態及升溫、降溫曲線對凸塊空孔的形成之影響，並找出控制凸塊空孔的最佳化製程條件。 Since screen printing has advantages of mass production and low cost, it is the popular solder bump process. The Solder Bump is a connector on the UBM (Under Bump Metallurgy) in Wafer Bump assembly process. It usually is produced by solder plating or solder printer process, however the void appear in the fine scale solder bump in screen printing process, cause bump break and shift moving in the Flip Chip process. For this study, we will explore in screen printing process, the effect of parameters in reflow process such as heating/cooling curve, improve solder bump process to the formative of the bump voids. As a result, by control way the heating/cooling curve property, we can improve the solder bump failure rate and improve the yield of the screen print process. It is found that the maximum heating temperature should be set to higher than the eutectic temperature of Pb/Sn alloy, and a minimum cooling rate is necessary for the transfer motion from liquid to solid phase at equilibrium state.
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