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BGA(球柵陣列)電子構裝中基板裸露金區對膠體脫層影響之研究 = The...

國立高雄大學電機工程學系碩士班

BGA(球柵陣列)電子構裝中基板裸露金區對膠體脫層影響之研究 = The Study Of Delaminating At Interface Between Molding Compound And Gold Substrate Bond Pad In BGA(Ball Grid Array) Package

Record Type:	Language materials, printed : monographic
Paralel Title:	The Study Of Delaminating At Interface Between Molding Compound And Gold Substrate Bond Pad In BGA(Ball Grid Array) Package
Author:	謝清俊,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	民99[2010]
Description:	77面圖，表 : 30公分;
Subject:	脫層
Subject:	Delaminating
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/72826754965637806408
Summary:	聯合電子設備電子工程委員會(JEDEC)，規範半導體產業相關規格標準,包含尺寸大小規格，環境測試項目(Pre-con)、可靠度測試(Reliability test) 標準項目【1】，做為從事半導體產業共同規範與標準。輕、薄、短、小、高I/O、多功能、低價格、高品質之3C產品(Computer、Consumer、Communication)需求與綠色環保產品要求為IC產品發展趨勢，不斷挑戰產品尺寸、材料安全，促使封裝製造廠與材料供應商日益精進研發新封裝製程與材料技術。本人負責BGA(Ball Grid Array)封裝新產品導入量產之驗證作業,使用已被驗證通過之標準化製程與材料。，其中有一IC產品於Pre-con測試後，遭遇到膠體與銲線區脫層缺點之品質問題。此研究主題，在假設不更改標準製程與材料前提下，依據產品脫層缺點模式，研究解決脫層缺點之製程方法。 Semi-conduct product criteria that include standards of product dimension and reliability condition is defined by Joint Electron Device Engineering Council (JEDEC)。 Lighter weight、thinner thickness、 smaller size、high I/O pins、low cost、high functions 、high quality and green environmental material are trend of IC products development and challenge manufacturer and material supplier to study new technology and new material。 I am in charged of new device package development for mass production. During new product development by using that a qualified process and standard material. A quality issue that product occurred delaminating defect between compound and wire bonding area after product pre-con test has been formed.The object of this thesis is to development a assumed process to eliminate delaminating defect without changing standard assembly process and material.

BGA(球柵陣列)電子構裝中基板裸露金區對膠體脫層影響之研究 = The Study Of Delaminating At Interface Between Molding Compound And Gold Substrate Bond Pad In BGA(Ball Grid Array) Package
謝, 清俊

BGA(球柵陣列)電子構裝中基板裸露金區對膠體脫層影響之研究 = The Study Of Delaminating At Interface Between Molding Compound And Gold Substrate Bond Pad In BGA(Ball Grid Array) Package / 謝清俊撰 - [高雄市] : 撰者, 民99[2010]. - 77面 ; 圖，表 ; 30公分.
參考書目：面.
脫層Delaminating

BGA(球柵陣列)電子構裝中基板裸露金區對膠體脫層影響之研究 = The Study Of Delaminating At Interface Between Molding Compound And Gold Substrate Bond Pad In BGA(Ball Grid Array) Package
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