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Advanced materials for thermal manag...

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Advanced materials for thermal management of electronic packaging

Record Type:	Electronic resources : Monograph/item
Title/Author:	Advanced materials for thermal management of electronic packagingby Xingcun Colin Tong.
Author:	Tong, Xingcun Colin.
Published:	New York, NY :Springer Springer Science+Business Media, LLC,2011.
Description:	xxi, 606 p. :ill. (some col.), digital ;24 cm.
Series:	Springer series in advanced microelectronics,
Contained By:	Springer eBooks
Subject:	Electronic packaging.
Online resource:	http://dx.doi.org/10.1007/978-1-4419-7759-5
ISBN:	9781441977595 (electronic bk.)

Advanced materials for thermal management of electronic packaging
Tong, Xingcun Colin.

Advanced materials for thermal management of electronic packaging[electronic resource] /by Xingcun Colin Tong. - New York, NY :Springer Springer Science+Business Media, LLC,2011. - xxi, 606 p. :ill. (some col.), digital ;24 cm. - Springer series in advanced microelectronics,301437-0387 ;.

ISBN: 9781441977595 (electronic bk.)Subjects--Topical Terms:

182161
Electronic packaging.

LC Class. No.: TK7870.15 / .T66 2011

Dewey Class. No.: 621.381046

Advanced materials for thermal management of electronic packaging
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003 Springer
005 20110713161834.0
006 m d
007 cr nn 008maaau
008 110816s2011 nyu s j eng d
020 $a 9781441977595 (electronic bk.)
020 $a 9781441977588 (paper)
035 $a 978-1-4419-7758-8
050 0 4 $a TK7870.15 $b .T66 2011
082 0 4 $a 621.381046 $2 22
090 $a TK7870.15 $b .T665 2011
100 1 $a Tong, Xingcun Colin. $3 510727
245 1 0 $a Advanced materials for thermal management of electronic packaging $h [electronic resource] / $c by Xingcun Colin Tong.
260 $a New York, NY : $b Springer Springer Science+Business Media, LLC, $c 2011.
300 $a xxi, 606 p. : $b ill. (some col.), digital ; $c 24 cm.
440 0 $a Springer series in advanced microelectronics, $x 1437-0387 ; $v 30
650 0 $a Electronic packaging. $3 182161
650 0 $a Materials. $3 203115
650 1 4 $a Physics. $3 179414
650 2 4 $a Electronic Circuits and Devices. $3 495609
650 2 4 $a Optical and Electronic Materials. $3 274099
650 2 4 $a Engineering Thermodynamics, Heat and Mass Transfer. $3 338996
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-1-4419-7759-5
950 $a Engineering (Springer-11647)

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