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Bond graph modelling of engineering ...
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Borutzky, Wolfgang.
Bond graph modelling of engineering systemstheory, applications and software support /
Record Type:
Electronic resources : Monograph/item
Title/Author:
Bond graph modelling of engineering systemsedited by Wolfgang Borutzky.
Reminder of title:
theory, applications and software support /
other author:
Borutzky, Wolfgang.
Published:
New York, NY :Springer Science+Business Media, LLC,2011.
Description:
xvi, 435 p. :ill., digital ;24 cm.
Contained By:
Springer eBooks
Subject:
Bond graphs.
Online resource:
http://dx.doi.org/10.1007/978-1-4419-9368-7
ISBN:
9781441993687 (electronic bk.)
Bond graph modelling of engineering systemstheory, applications and software support /
Bond graph modelling of engineering systems
theory, applications and software support /[electronic resource] :edited by Wolfgang Borutzky. - New York, NY :Springer Science+Business Media, LLC,2011. - xvi, 435 p. :ill., digital ;24 cm.
ISBN: 9781441993687 (electronic bk.)Subjects--Topical Terms:
206855
Bond graphs.
LC Class. No.: TA338.B6 / B66 2011
Dewey Class. No.: 620.00113
Bond graph modelling of engineering systemstheory, applications and software support /
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[electronic resource] :
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theory, applications and software support /
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edited by Wolfgang Borutzky.
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New York, NY :
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Springer Science+Business Media, LLC,
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2011.
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xvi, 435 p. :
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ill., digital ;
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24 cm.
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Bond graphs.
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Engineering systems
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Borutzky, Wolfgang.
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Engineering (Springer-11647)
based on 0 review(s)
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電子館藏
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1 records • Pages 1 •
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000000056217
電子館藏
1圖書
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EB TA338.B6 B66 2011
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0
1 records • Pages 1 •
1
Multimedia
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http://dx.doi.org/10.1007/978-1-4419-9368-7
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