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The future envelope 2architecture, c...

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Klein, Tillmann.

The future envelope 2architecture, climate, skin /

Record Type:	Electronic resources : Monograph/item
Title/Author:	The future envelope 2edited by Ulrich Knaack & Tillmann Klein.
Reminder of title:	architecture, climate, skin /
remainder title:	Future envelope two
other author:	Knaack, Ulrich.
Published:	Amsterdam :IOS Press,c2009.
Description:	vii, 142 p. :ill. ;24 cm.
Notes:	Based on the contributions to The Future Envelope symposium held June 5, 2008 in Delft.
Subject:	FacadesDesign and construction.
Online resource:	http://ebooks.windeal.com.tw/ios/cover.asp?isbn=9781607500261
ISBN:	9781607505242 (electronic bk.)

The future envelope 2architecture, climate, skin /
The future envelope 2architecture, climate, skin /[electronic resource] :Future envelope twoedited by Ulrich Knaack & Tillmann Klein. - Amsterdam :IOS Press,c2009. - vii, 142 p. :ill. ;24 cm. - Research in architectural engineering series,v. 91873-6033 ;. - Research in architectural engineering series ;v. 9..

Based on the contributions to The Future Envelope symposium held June 5, 2008 in Delft.

Includes bibliographical references.

ISBN: 9781607505242 (electronic bk.)

LCCN: 2010290874Subjects--Topical Terms:

222981
Facades
--Design and construction.

LC Class. No.: TH2235 / .F882 2009

Dewey Class. No.: 729/.1

The future envelope 2architecture, climate, skin /
LDR:00951cmm a22002294a 45 001 309267
005 19991118135338.0
008 111207s2009 ne a sb 000 0 eng
010 $a 2010290874
020 $a 9781607505242 (electronic bk.)
020 $a 9781607500261 (pbk.)
035 $a 00000467
040 $a DLC $c DLC
050 0 0 $a TH2235 $b .F882 2009
082 0 4 $a 729/.1 $2 22
245 0 4 $a The future envelope 2 $h [electronic resource] : $b architecture, climate, skin / $c edited by Ulrich Knaack & Tillmann Klein.
246 3 $a Future envelope two
260 $a Amsterdam : $b IOS Press, $c c2009.
300 $a vii, 142 p. : $b ill. ; $c 24 cm.
490 1 $a Research in architectural engineering series, $x 1873-6033 ; $v v. 9
500 $a Based on the contributions to The Future Envelope symposium held June 5, 2008 in Delft.
504 $a Includes bibliographical references.
650 0 $a Facades $x Design and construction. $3 222981
650 0 $a Architecture and climate. $3 220465
700 1 $a Knaack, Ulrich. $3 483430
700 1 $a Klein, Tillmann. $3 483431
830 0 $a Research in architectural engineering series ; $v v. 9. $3 530286
856 4 $u http://ebooks.windeal.com.tw/ios/cover.asp?isbn=9781607500261

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EB TH2235 .F882 2009

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http://ebooks.windeal.com.tw/ios/cover.asp?isbn=9781607500261

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