Lead free soldermechanics and reliab...
Pang, John Hock Lye.

 

  • Lead free soldermechanics and reliability /
  • Record Type: Electronic resources : Monograph/item
    Title/Author: Lead free solderby John Hock Lye Pang.
    Reminder of title: mechanics and reliability /
    Author: Pang, John Hock Lye.
    Published: New York, NY :Springer Science+Business Media, LLC,2012.
    Description: x, 175 p. :ill., digital ;24 cm.
    Contained By: Springer eBooks
    Subject: Solder and soldering.
    Online resource: http://dx.doi.org/10.1007/978-1-4614-0463-7
    ISBN: 9781461404637 (electronic bk.)
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