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Lead free soldermechanics and reliab...
~
Pang, John Hock Lye.
Lead free soldermechanics and reliability /
Record Type:
Electronic resources : Monograph/item
Title/Author:
Lead free solderby John Hock Lye Pang.
Reminder of title:
mechanics and reliability /
Author:
Pang, John Hock Lye.
Published:
New York, NY :Springer Science+Business Media, LLC,2012.
Description:
x, 175 p. :ill., digital ;24 cm.
Contained By:
Springer eBooks
Subject:
Solder and soldering.
Online resource:
http://dx.doi.org/10.1007/978-1-4614-0463-7
ISBN:
9781461404637 (electronic bk.)
Lead free soldermechanics and reliability /
Pang, John Hock Lye.
Lead free solder
mechanics and reliability /[electronic resource] :by John Hock Lye Pang. - New York, NY :Springer Science+Business Media, LLC,2012. - x, 175 p. :ill., digital ;24 cm.
ISBN: 9781461404637 (electronic bk.)Subjects--Topical Terms:
182496
Solder and soldering.
LC Class. No.: TS610 / .P36 2012
Dewey Class. No.: 671.52
Lead free soldermechanics and reliability /
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Lead free solder
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[electronic resource] :
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mechanics and reliability /
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by John Hock Lye Pang.
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New York, NY :
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Springer Science+Business Media, LLC,
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2012.
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ill., digital ;
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Solder and soldering.
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Engineering (Springer-11647)
based on 0 review(s)
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電子館藏
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1 records • Pages 1 •
1
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Attachments
000000066694
電子館藏
1圖書
電子書
EB TS610 .P191 2012
一般使用(Normal)
On shelf
0
1 records • Pages 1 •
1
Multimedia
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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