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紫外光的雷射加工技術應用於散熱片製程研究 = UV laser proc...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

紫外光的雷射加工技術應用於散熱片製程研究 = UV laser processing technology applied heat slug research

Record Type:	Language materials, printed : monographic
Paralel Title:	UV laser processing technology applied heat slug research
Author:	林子翔,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2014[民103]
Description:	50葉圖，表格 : 30公分;
Subject:	紫外光雷射
Subject:	UV Laser
Online resource:	https://hdl.handle.net/11296/3k7za4
Notes:	108年3月25日公開
Notes:	參考書目：葉49-50
Summary:	隨著晶圓技術的進步，晶圓上元件的尺寸逐漸縮小，提升積體電路密度，降低製造成本，使得隨身電子產品也越來越輕薄短小，但相對的，隨著尺寸的縮小，高功率、高效能的晶片所產生的廢熱更不易排除，散熱困難更會導致晶片壽命的縮短。因此球閘陣列封裝增加了散熱片製程，來改善散熱的問題，然而散熱片在刀具切割時會出現銅絲毛邊、散熱片剝離等問題，本篇論文中，主要利用紫外光雷射來取代現有的刀具二次切割，透過比較功率、頻率、切割速度來評估散熱片球閘陣列使用雷射加工的可行性研究。 As the wafer technology enhanced, the devices on the wafer are getting smaller, the integration of the circuits will increase reduces the cost. As the electronic package become thinner and smaller, the high power and high speed circuit filled in small body size makes thermal problem more critical for life time. Therefore, heat slug was used to improve the thermal problem in BGA products. However, traditional die sawing encounter problem of copper burr, heat slug peeling. In this thesis, we demonstrate UV laser cutting of heat slug metal and to evaluate the parameters of UV laser cutting with the relationship of power, frequency, and speed. We shows that the UV laser cutting is effective to achieve liable cutting edge and trench of the heat slug metal.

紫外光的雷射加工技術應用於散熱片製程研究 = UV laser processing technology applied heat slug research
林, 子翔

紫外光的雷射加工技術應用於散熱片製程研究 = UV laser processing technology applied heat slug research / 林子翔撰 - [高雄市] : 撰者, 2014[民103]. - 50葉 ; 圖，表格 ; 30公分.
108年3月25日公開參考書目：葉49-50.
紫外光雷射UV Laser

紫外光的雷射加工技術應用於散熱片製程研究 = UV laser processing technology applied heat slug research
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