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探討銅線wire bond製程與可靠度實驗關係 = The Study ...

國立高雄大學電機工程學系碩士班

探討銅線wire bond製程與可靠度實驗關係 = The Study for Reliability of Wire-bonding Process by Copper Wire

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	The Study for Reliability of Wire-bonding Process by Copper Wire
作者:	洪崇偉,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2014[民103]
面頁冊數:	69葉圖,表 : 30公分;
標題:	半導體封裝
標題:	IC Semiconductors
電子資源:	https://hdl.handle.net/11296/7m5tt9
附註:	108年10月31日公開
附註:	參考書目：葉54-55
摘要註:	隨著時代技術的進步，各種精密電子設備皆朝向輕、薄、短、小、等人性化的設計；在半導體封裝產業領域裡，所呈現出的競爭優勢為高密度(high density)與高腳數（High Pin counts or I/O）趨勢。由於BGA（Ball Grid Array球閘陣列封裝）封裝技術，原理在晶粒底部以陣列的方式佈滿許多錫球，以錫球代替傳統用金屬導線架在周圍做引腳的方式，此種封裝技術的好處可在同樣尺寸面積下，引腳數變多，其封裝面積及重量只達QFP（Quad Flat Pack方塊形扁平封裝）方式的一半，並具有良好的電導性質、散熱性質，及可有效縮小封裝面積，使其需求成長率遠高於其他型態的封裝方式，目前手機、平板、等3C產品多己應用BGA封裝技術。本研究欲開發出滿足球閘陣列封與銅線銲接製程多重品質特性最佳化之製程技術，因此Ｌ9（正交表安排實驗）分別求得滿足拉力、推球、IMC、Ｘ-section、等品質特性數據，再結合可靠度實驗，找出同時可滿足此最適參數組合，來設計具有能同時滿足多重品質特性之組合。 As technical developments progressed, semi-conductor packaging is now heading toward slender, high-density and high capillary count directions. At present, domestic package techniques are BGA(Ball Grid Array), QFP(Plastic Quad Flat Package), SOP(Small Out-Line Package), PLCC (Plastic Leaded Chip Carrier) and PDIP(PDIP Plastic Dual In-Line Package )based package techniques. Since BGA package technique generally involves solder ball arrayed at the base of chip base, solder ball replaces traditional lead frame surrounded by pins. One advantage of this type of package technique is that the No. of pins may increase with same size and area while the package area and weight are only half the QFP. It also has good electric and heat dissipation properties as well as package area reduction feature. Its demand and growth rate greatly exceed other package methods. Currently, most, information home electronic appliances and 3C products have adopted BGA package technique. This study aims is to pass reliability of wire-bonding process by copper wire. Based on the 3 quality characteristics of process intended for discussion, wire pull, ball shear , Internal Metal Coverage of the quality characteristics are obtained. Then, by use of Orthogonal array L9 and Reliability Temperature cycle Test, analysis why Internal Metal Coverage is the major factor to influence Open Test after Reliability. In addition, in order to pass reliability test, how to do good Internal Metal Coverage sample. The feasibility of this study method tested is further verified.

探討銅線wire bond製程與可靠度實驗關係 = The Study for Reliability of Wire-bonding Process by Copper Wire
洪, 崇偉

探討銅線wire bond製程與可靠度實驗關係 = The Study for Reliability of Wire-bonding Process by Copper Wire / 洪崇偉撰 - [高雄市] : 撰者, 2014[民103]. - 69葉 ; 圖,表 ; 30公分.
108年10月31日公開參考書目：葉54-55.
半導體封裝IC Semiconductors

探討銅線wire bond製程與可靠度實驗關係 = The Study for Reliability of Wire-bonding Process by Copper Wire
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