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Feature profile evolution in plasma ...

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Samukawa, Seiji.

Feature profile evolution in plasma processing using on-wafer monitoring system

Record Type:	Electronic resources : Monograph/item
Title/Author:	Feature profile evolution in plasma processing using on-wafer monitoring systemby Seiji Samukawa.
Author:	Samukawa, Seiji.
Published:	Tokyo :Springer Japan :2014.
Description:	viii, 40 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Plasma engineering.
Online resource:	http://dx.doi.org/10.1007/978-4-431-54795-2
ISBN:	9784431547952 (electronic bk.)

Feature profile evolution in plasma processing using on-wafer monitoring system
Samukawa, Seiji.

Feature profile evolution in plasma processing using on-wafer monitoring system[electronic resource] /by Seiji Samukawa. - Tokyo :Springer Japan :2014. - viii, 40 p. :ill., digital ;24 cm. - SpringerBriefs in applied sciences and technology,2191-530X. - SpringerBriefs in applied sciences and technology..

ISBN: 9784431547952 (electronic bk.)Subjects--Topical Terms:

282445
Plasma engineering.

Dewey Class. No.: 621.044

Feature profile evolution in plasma processing using on-wafer monitoring system
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245 1 0 $a Feature profile evolution in plasma processing using on-wafer monitoring system $h [electronic resource] / $c by Seiji Samukawa.
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650 0 $a Plasma engineering. $3 282445
650 0 $a Plasma etching. $3 225107
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EB TA2020 S193 2014

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http://dx.doi.org/10.1007/978-4-431-54795-2

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