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FCBGA單顆基板注模設計應用之研究 = The Design and ...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

FCBGA單顆基板注模設計應用之研究 = The Design and Implementation of Molding for Single Unit FCBGA Package

Record Type:	Language materials, printed : monographic
Paralel Title:	The Design and Implementation of Molding for Single Unit FCBGA Package
Author:	王琮硯,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2015[民104]
Description:	[8], 27面彩圖，表 : 30公分;
Subject:	FCBGA
Subject:	FCBGA
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/62009847735490544945
Notes:	參考書目：面26-27
Notes:	104年3月25日公開
Summary:	本論文將利用改變製程方式將現行FCBGA單顆基板產品依照FCCSP條狀基板方式重新規劃並排列後注模，再加以分析探討FCBGA單顆基板注模是否具有防止基板翹曲基板價格的功效。目前FCBGA產品有越來越薄型化的趨勢，故封裝製程技術上，最主要的可靠度問題是翹曲(Warpage)，使用FCBGA單顆基板注模封裝製程，其基版總厚度可以變薄，故本研究將針對基板尺寸10x10mm2的FCBGA單顆注模封裝與FCCSP條狀基板封裝做熱特性模擬分析及翹曲模擬分析。由模擬結果證實利用FCBGA單顆注模製程，不但可以節省基板成本，且結合FCBGA單顆基版與FCCSP條狀基版的優點，故FCBGA單顆注模製程可取代基板尺寸小於10x10mm2的FCCSP成為應用在球柵陣列構裝中，成本最低的ABF基板設計。 In this thesis statement, we will discuss in single FCBGA with molding whether will prevent Warpage and further cost-down by changing to present assembly of FCBGA which is rearranged by the strip size and then add molding.The FCBGA product is in a trend to become thinner than before, therefore, the most important barrier and reliability issue is the warpage. FCBGA product uses single unit molding technique, which the total thickness can become thinner. In this study will focus in size of 10x10mm2 FCBGA in comparison with FCCSP of which thermal characteristics simulation analysis and warpage simulation analysis.By the analysis data which proven using single package molding in FCBGA will costless in budget furthermore it combines the advantages of the FCCSP package. In conclusion, single FCBGA with molding process can replace the process of FCCSP substrate in ball grid array package which is smaller the 10x10mm2. Thus become the lowest in cost in ABF packaging method.

FCBGA單顆基板注模設計應用之研究 = The Design and Implementation of Molding for Single Unit FCBGA Package
王, 琮硯

FCBGA單顆基板注模設計應用之研究 = The Design and Implementation of Molding for Single Unit FCBGA Package / 王琮硯撰 - [高雄市] : 撰者, 2015[民104]. - [8], 27面 ; 彩圖，表 ; 30公分.
參考書目：面26-27104年3月25日公開.
FCBGAFCBGA

FCBGA單顆基板注模設計應用之研究 = The Design and Implementation of Molding for Single Unit FCBGA Package
LDR:03008nam0a2200289 450 001 446546
005 20170214090210.0
009 446546
010 0 $b 精裝
010 0 $b 平裝
100 $a 20170214d2015 k y0chiy05 e
101 1 $a chi $d chi $d eng
102 $a tw
105 $a ak am 000yy
200 1 $a FCBGA單顆基板注模設計應用之研究 $d The Design and Implementation of Molding for Single Unit FCBGA Package $z eng $f 王琮硯撰
210 $a [高雄市] $c 撰者 $d 2015[民104]
215 0 $a [8], 27面 $c 彩圖，表 $d 30公分
300 $a 參考書目：面26-27
300 $a 104年3月25日公開
314 $a 指導教授：施明昌教授
328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
330 $a 本論文將利用改變製程方式將現行FCBGA單顆基板產品依照FCCSP條狀基板方式重新規劃並排列後注模，再加以分析探討FCBGA單顆基板注模是否具有防止基板翹曲基板價格的功效。目前FCBGA產品有越來越薄型化的趨勢，故封裝製程技術上，最主要的可靠度問題是翹曲(Warpage)，使用FCBGA單顆基板注模封裝製程，其基版總厚度可以變薄，故本研究將針對基板尺寸10x10mm2的FCBGA單顆注模封裝與FCCSP條狀基板封裝做熱特性模擬分析及翹曲模擬分析。由模擬結果證實利用FCBGA單顆注模製程，不但可以節省基板成本，且結合FCBGA單顆基版與FCCSP條狀基版的優點，故FCBGA單顆注模製程可取代基板尺寸小於10x10mm2的FCCSP成為應用在球柵陣列構裝中，成本最低的ABF基板設計。 In this thesis statement, we will discuss in single FCBGA with molding whether will prevent Warpage and further cost-down by changing to present assembly of FCBGA which is rearranged by the strip size and then add molding.The FCBGA product is in a trend to become thinner than before, therefore, the most important barrier and reliability issue is the warpage. FCBGA product uses single unit molding technique, which the total thickness can become thinner. In this study will focus in size of 10x10mm2 FCBGA in comparison with FCCSP of which thermal characteristics simulation analysis and warpage simulation analysis.By the analysis data which proven using single package molding in FCBGA will costless in budget furthermore it combines the advantages of the FCCSP package. In conclusion, single FCBGA with molding process can replace the process of FCCSP substrate in ball grid array package which is smaller the 10x10mm2. Thus become the lowest in cost in ABF packaging method.
510 1 $a The Design and Implementation of Molding for Single Unit FCBGA Package $z eng
610 0 $a FCBGA $a FCCSP $a 基板設計 $a ABF基板 $a BT基板
610 1 $a FCBGA $a FCCSP $a Substrate Design $a ABF Substrate $a BT Substrate
681 $a 008M/0019 $b 542201 1011 $v 2007年版
700 1 $a 王 $b 琮硯 $4 撰 $3 700852
712 0 2 $a 國立高雄大學 $b 電機工程學系--先進電子構裝技術產業研發碩士專班 $3 170852
801 0 $a tw $b NUK $c 20150310 $g CCR
856 7 $z 電子資源 $2 http $u http://handle.ncl.edu.tw/11296/ndltd/62009847735490544945