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遠程電漿系統應用於化學氣相沉積腔體清潔流場之模擬 = Simulate ...

國立高雄大學電機工程學系碩士班

遠程電漿系統應用於化學氣相沉積腔體清潔流場之模擬 = Simulate of PECVD Chamber Clean Using Remote Plasma System

Record Type:	Language materials, printed : monographic
Paralel Title:	Simulate of PECVD Chamber Clean Using Remote Plasma System
Author:	紀和成,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2015[民104]
Description:	51面圖，表 : 30公分;
Subject:	遠距電漿系統
Subject:	remote plasma system
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/86404354665964530613
Notes:	參考書目：面40-42
Summary:	薄膜沉積是半導體製程中的其中一環，一般來說，在自動化薄膜製程的機台上，都會有自行清潔腔體的功能，因為當矽晶圓完成鍍薄膜後，腔體需把腔體上鍍薄膜的部分清除掉，重新鍍一層薄膜上去，通常要完成這個工作會使用遠距電漿系統。遠距電漿系統透過微波氬氣產生的電漿，將氟化氮分解成氮氣和游離的氟離子，進入腔體後，藉由氟離子強大的活性，去除製程中剩餘的二氧化矽，達成製程腔體內的清潔作用。目前在業界，例如應用材料公司等半導體設備商，普遍使用遠距電漿系統達到腔體清潔的目的，以增加矽晶圓的產量。因此，如何使系統能達到最大的作用，是一個重要的議題。本研究使用COMSOL(多重物理耦合模擬)，去模擬遠距電漿系統產生的電漿在腔體裡面的流場，藉著改變加熱板到上方精密噴灑頭的間距，來模擬及探討流場的改變。模擬結果顯示，加熱板表面的壓力隨間距減少而增加，而加熱板下方隨間距減少(6.5公分減低到3公分)而流場增加，清潔效果上升。但氣體流場在間距為3公分時，流場不會繼續增加。同時，間距從3公分減少到2公分時，加熱板表面的壓力會增加，可能造成加熱板表面的過度清潔，而縮短加熱板的壽命，增加成本的支出，且並未達到清潔效果的提升。 Thin film deposition is one of the most important processes in fabricating semiconductor devices. An automatic deposition system usually equiped with self-cleaning function; the system can clean a vacuum chamber after chemical reaction inside the chamber. Remote plasma system usually generates plasma by decomposing argon via buildt-in microwave generation system and the plasma thus ironize NF3 into nitrogen and fluoride ion that can react with silicon dioxide residue around the chamber to achieve self-clean. Some semiconductor manufacturing companies, such as Applied Materials, use Remote plasma system to enhance the self-cleaning and wafer throughput. Therefore, maintenance period extension and self-cleaning enhancement become important issues for an equipment engineer. This thesis studied the cleaning efficiency via plasma flow and lifetime of the heater via out wall pressure of a reaction chamber using finite element modeling. The results indicate that the pressure of the heater and the plasma flow increases with decreasing spacing (from 6.5 to 3 cm), wherein the spacing is the distance between heater and showerhead. However, the plasma flow is limited from going up when the spacing was beyond 3 cm. This result implies the heater may be over cleaned, or improperly cleaned. On the contrast, the lifetime can be shortened when the spacing is too small.

遠程電漿系統應用於化學氣相沉積腔體清潔流場之模擬 = Simulate of PECVD Chamber Clean Using Remote Plasma System
紀, 和成

遠程電漿系統應用於化學氣相沉積腔體清潔流場之模擬 = Simulate of PECVD Chamber Clean Using Remote Plasma System / 紀和成撰 - [高雄市] : 撰者, 2015[民104]. - 51面 ; 圖，表 ; 30公分.
參考書目：面40-42.
遠距電漿系統remote plasma system

遠程電漿系統應用於化學氣相沉積腔體清潔流場之模擬 = Simulate of PECVD Chamber Clean Using Remote Plasma System
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