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球柵陣列電子構裝中多層基板之電源層與接地層整合研究 = The Inte...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

球柵陣列電子構裝中多層基板之電源層與接地層整合研究 = The Integration of Power and Ground Line Layout Design in Multi-Layer Substrate for Ball Grid Array Package

Record Type:	Language materials, printed : monographic
Paralel Title:	The Integration of Power and Ground Line Layout Design in Multi-Layer Substrate for Ball Grid Array Package
Author:	洪秀媛,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2015[民104]
Description:	79面圖，表 : 30公分;
Subject:	基板設計
Subject:	Substrate Design
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/50619317464725307567
Notes:	104年10月31日公開
Notes:	參考書目：面67-68
Summary:	BGA基板佈局設計因具有多樣性,目前並沒有一套Layout 的準則。基板佈局的面積,因為不同的Layout手法會產生不同的基板的面積差異,本論文將藉由四層基板轉換到三層基板的佈局分析,探討最佳化的基板佈局條件。本文係針對BGA四層基板佈局設計,在不影響其原有電性阻抗、I/O排列方式及重要電源(PWR)/接地(GND)訊號串接的情形下,進行三層基板的重新佈局設計,得到佈局設計重新規劃的條件。分析結果得到,當接地訊號的舖銅面積若小於30%時,因為受限於最小線寬,則接地訊號無法在基板上做串連。當電源層的舖銅面積縮小時,電流密度及熱效應也會隨之而上升,故面積縮小比例有其一定的限制。 BGA substrate design routing was diversity, currently does not have a layout guidelines. The substrate routing area will differences due to different routing techniques, this paper will explore the optimization of substrate layout, through the substrate layer converted from 4 layers to 3 layers layout analysis. In this paper, will directed to BGA 4 layers substrate, and re-layout to 3 layers substrate, without affecting it's original electrical impedance, I / O arrangement and significant power (PWR) / ground (GND) signals connection. After analysis, when ground signal's area less than 30%, restricted to the minimum line width, the ground signal can't be connect in the substrate, the current density and thermal effects will increase in the meantime, so the area of the reduction ratio has its limitations.

球柵陣列電子構裝中多層基板之電源層與接地層整合研究 = The Integration of Power and Ground Line Layout Design in Multi-Layer Substrate for Ball Grid Array Package
洪, 秀媛

球柵陣列電子構裝中多層基板之電源層與接地層整合研究 = The Integration of Power and Ground Line Layout Design in Multi-Layer Substrate for Ball Grid Array Package / 洪秀媛撰 - [高雄市] : 撰者, 2015[民104]. - 79面 ; 圖，表 ; 30公分.
104年10月31日公開參考書目：面67-68.
基板設計Substrate Design

球柵陣列電子構裝中多層基板之電源層與接地層整合研究 = The Integration of Power and Ground Line Layout Design in Multi-Layer Substrate for Ball Grid Array Package
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314 $a 指導教授：施明昌教授
328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
330 $a BGA基板佈局設計因具有多樣性,目前並沒有一套Layout 的準則。基板佈局的面積,因為不同的Layout手法會產生不同的基板的面積差異,本論文將藉由四層基板轉換到三層基板的佈局分析,探討最佳化的基板佈局條件。本文係針對BGA四層基板佈局設計,在不影響其原有電性阻抗、I/O排列方式及重要電源(PWR)/接地(GND)訊號串接的情形下,進行三層基板的重新佈局設計,得到佈局設計重新規劃的條件。分析結果得到,當接地訊號的舖銅面積若小於30%時,因為受限於最小線寬,則接地訊號無法在基板上做串連。當電源層的舖銅面積縮小時,電流密度及熱效應也會隨之而上升,故面積縮小比例有其一定的限制。 BGA substrate design routing was diversity, currently does not have a layout guidelines. The substrate routing area will differences due to different routing techniques, this paper will explore the optimization of substrate layout, through the substrate layer converted from 4 layers to 3 layers layout analysis. In this paper, will directed to BGA 4 layers substrate, and re-layout to 3 layers substrate, without affecting it's original electrical impedance, I / O arrangement and significant power (PWR) / ground (GND) signals connection. After analysis, when ground signal's area less than 30%, restricted to the minimum line width, the ground signal can't be connect in the substrate, the current density and thermal effects will increase in the meantime, so the area of the reduction ratio has its limitations.
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