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錫銀銅銲錫添加不同金屬元素之高速衝球試驗研究 = The Ball Im...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

錫銀銅銲錫添加不同金屬元素之高速衝球試驗研究 = The Ball Impact Test Study of Metal-doped Sn-Ag-Cu Solder Joints

Record Type:	Language materials, printed : monographic
Paralel Title:	The Ball Impact Test Study of Metal-doped Sn-Ag-Cu Solder Joints
Author:	蔡靜宜,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2015[民104]
Description:	82面圖，表 : 30公分;
Subject:	高速衝球試驗
Subject:	BIT
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/34850382292001822505
Notes:	參考書目：面56-58
Summary:	本論文在主成分為錫銀銅的無鉛銲錫中,添加不同的金屬元素鍺、鎳和鉍等,使用高速衝球試驗 (High-speed ball impact test,BIT) 來評估銲錫接點的可靠度影響。主要探討在錫銀銅中的這些摻雜金屬元素後,銲錫接點對機械性質強度及介金屬化合物(Intermetallic compound,IMC)的微結構、破壞模式的影響。結果顯示,在銲錫成分上,添加金屬元素鎳和鉍在適當的比例下,可以有效抑制IMC 厚度成長,使銲錫由脆破壞變成延性破壞。另摻雜其他的金屬元素後,銲錫表面結構由疏散塊狀變成緊緻的粒狀,其接合強度與延性皆有顯著的提升。 This thesis aims to evaluate the reliability performance of solder joint with different metal dopants. The standard lead-free solder which is composed of Sn-Ag-Cu is doped with different metal elements of Ge/Ni/Bi, and experimented by high-speed ball impact test (BIT) were applied to identify the impact on reliability performance. The influence of solder joint interface caused by different metal dopants on mechanical strength, micro-structure of intermetallic compound (IMC), and destructive patterns is studied. Based on the experiment result, add appropriate ratio of nickel and bismuth can effectively suppress IMC thickness, and change solder from brittle damage to ductile damage. When standard solder ball is doped with other metal elements, the surface of solder changes from sparse bulk to solid grain, hence the strength and ductility of solder joint interface are significantly improved.

錫銀銅銲錫添加不同金屬元素之高速衝球試驗研究 = The Ball Impact Test Study of Metal-doped Sn-Ag-Cu Solder Joints
蔡, 靜宜

錫銀銅銲錫添加不同金屬元素之高速衝球試驗研究 = The Ball Impact Test Study of Metal-doped Sn-Ag-Cu Solder Joints / 蔡靜宜撰 - [高雄市] : 撰者, 2015[民104]. - 82面 ; 圖，表 ; 30公分.
參考書目：面56-58.
高速衝球試驗BIT

錫銀銅銲錫添加不同金屬元素之高速衝球試驗研究 = The Ball Impact Test Study of Metal-doped Sn-Ag-Cu Solder Joints
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314 $a 指導教授：藍文厚博士
328 $a 碩士論文--國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班
330 $a 本論文在主成分為錫銀銅的無鉛銲錫中,添加不同的金屬元素鍺、鎳和鉍等,使用高速衝球試驗 (High-speed ball impact test,BIT) 來評估銲錫接點的可靠度影響。主要探討在錫銀銅中的這些摻雜金屬元素後,銲錫接點對機械性質強度及介金屬化合物(Intermetallic compound,IMC)的微結構、破壞模式的影響。結果顯示,在銲錫成分上,添加金屬元素鎳和鉍在適當的比例下,可以有效抑制IMC 厚度成長,使銲錫由脆破壞變成延性破壞。另摻雜其他的金屬元素後,銲錫表面結構由疏散塊狀變成緊緻的粒狀,其接合強度與延性皆有顯著的提升。 This thesis aims to evaluate the reliability performance of solder joint with different metal dopants. The standard lead-free solder which is composed of Sn-Ag-Cu is doped with different metal elements of Ge/Ni/Bi, and experimented by high-speed ball impact test (BIT) were applied to identify the impact on reliability performance. The influence of solder joint interface caused by different metal dopants on mechanical strength, micro-structure of intermetallic compound (IMC), and destructive patterns is studied. Based on the experiment result, add appropriate ratio of nickel and bismuth can effectively suppress IMC thickness, and change solder from brittle damage to ductile damage. When standard solder ball is doped with other metal elements, the surface of solder changes from sparse bulk to solid grain, hence the strength and ductility of solder joint interface are significantly improved.
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