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雷射晶圓印碼條件最佳化研究 = The Study of Optimiz...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

雷射晶圓印碼條件最佳化研究 = The Study of Optimization for Laser Marking on Si Wafer

Record Type:	Language materials, printed : monographic
Paralel Title:	The Study of Optimization for Laser Marking on Si Wafer
Author:	鐘明斌,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2015[民104]
Description:	52面圖，表 : 30公分;
Subject:	雷射
Subject:	Laser
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/70562888176623035729
Notes:	104年10月31日公開
Notes:	參考書目：面42
Summary:	隨著晶片封裝技術朝向輕、薄、小、高效能的方向發展,晶圓級晶片尺寸封裝 (Wafer Level Chip Scale Package,WLCSP),由於擁有尺寸小,性能優異及低成本之潛力,便成為一極受重視之封裝技術,一極受重視之封裝技術,傳統的打印印碼(Marking)技術在WLCSP封裝產品由於字體的解析能力不高,打印頭的機械施力容易造成晶粒的破壞以及封裝材料的環保要求等,逐漸採用雷射印碼技術,WLCSP的雷射印碼材質是矽晶圓,每次作業單位為整片晶圓,因此只要有部分字碼品質不符合品質,就必須整片晶圓進行重工,除影響生產效率,其作業風險也相對提高。重工,除影響生產效率,其作業風險也相對提高。因此本論文主要是探討晶圓級晶片尺寸封裝 (WLCSP)的雷射印碼最佳化印碼條件,我們探討雷射功率、脈衝頻率、打印速度對打印字碼辨識度的影響,並由實驗方法找出最佳化的雷射晶圓印碼條件,以確保印碼品質的穩定,提高產品良率。 As the size and weight of IC products become thinner and lighter, wafer level chip size package (WLCSP) had been developed for IC package with high effective form factor and liability. Since laser printing on Si surface is different from on the traditional molding compound in which the visual quality of laser print on Si wafer is required. Laser marking on WLCSP also raises risk of chip damage; if any mistake on the process, the whole wafer has to be rework that affects the manufacture efficiency. Therefore, this thesis is focused on the study of the laser marking parameters such as laser power, pulse frequency and writing speed, and to achieve a process margin of process for assured quality of visual ability.

雷射晶圓印碼條件最佳化研究 = The Study of Optimization for Laser Marking on Si Wafer
鐘, 明斌

雷射晶圓印碼條件最佳化研究 = The Study of Optimization for Laser Marking on Si Wafer / 鐘明斌撰 - [高雄市] : 撰者, 2015[民104]. - 52面 ; 圖，表 ; 30公分.
104年10月31日公開參考書目：面42.
雷射Laser

雷射晶圓印碼條件最佳化研究 = The Study of Optimization for Laser Marking on Si Wafer
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