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封膠注模條件對模具與封裝材料黏著性的效果研究 = The study o...

國立高雄大學電機工程學系--先進電子構裝技術產業研發碩士專班

封膠注模條件對模具與封裝材料黏著性的效果研究 = The study of molding conditions on Adhesion Force of Mold and packaging materials

Record Type:	Language materials, printed : monographic
Paralel Title:	The study of molding conditions on Adhesion Force of Mold and packaging materials
Author:	曾士誠,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	國立高雄大學;
Year of Publication:	2015[民104]
Description:	[8]，64葉圖，表 : 30公分;
Subject:	封膠材料
Subject:	Epoxy Molding Compound
Online resource:	https://hdl.handle.net/11296/d8nybr
Notes:	109年11月18日公開
Summary:	電子封裝製程中,封膠材料環氧樹脂,在模具內高溫高壓的情況下,完成封裝晶片、熱固成形、硬化的過程中,會與其他不同材料如模具表面、基板或導線架保持緊密的接觸,而和模具接觸的地方會產生黏著的現象。而模具表面的粗糙度2.0~2.4之間,部分封膠材料黏性較高,故造成封膠模具在作業後,就必須花費時間來將模具進行脫模的程序,因為封膠材料殘留在模具表面的殘留物質不加以清除,勢必會影響到封膠過程中會產生一些失敗模式產生,例如:膠體剝離等,使得封裝良率大大的降低。本研究係針對半導體封裝製程中封膠製程中封膠材料對封裝模具減少沾黏提升模具作業時間做研究。本研究將針對封裝模具上鍍上不同材質的材料,再利用電子顯微鏡來分析表面粗糙度等,並作表面接觸角與離模測試,將所鍍膜材料與封膠離模效果作分析比較,另外也將針對不同的封裝條件,研究不同的作業參數對封膠模具黏著力的效果做最佳化的製程條件探討。 In general, molding compound residual can occur due to high temperature and high pressure in molding process, and this residual become hard to be removed when limit times of process, and mold chase cleaning is necessary. The main goal of this thesis is to solve the problem of molding compound residual by improving a surface coating on mold chase surface. We found that the roughness of the mold chase surface is around 2.0-2.4 um which can be smoothened by coating different material such as alumina, diamond, and SiO2. A SEM was used to analyze the surface structure of the mold chase, such as surface roughness, and surface contact angles and die testing performance analysis.

封膠注模條件對模具與封裝材料黏著性的效果研究 = The study of molding conditions on Adhesion Force of Mold and packaging materials
曾, 士誠

封膠注模條件對模具與封裝材料黏著性的效果研究 = The study of molding conditions on Adhesion Force of Mold and packaging materials / 曾士誠撰 - [高雄市] : 國立高雄大學, 2015[民104]. - [8]，64葉 ; 圖，表 ; 30公分.
109年11月18日公開.
參考書目：葉51-53.
封膠材料Epoxy Molding Compound

封膠注模條件對模具與封裝材料黏著性的效果研究 = The study of molding conditions on Adhesion Force of Mold and packaging materials
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330 $a 電子封裝製程中,封膠材料環氧樹脂,在模具內高溫高壓的情況下,完成封裝晶片、熱固成形、硬化的過程中,會與其他不同材料如模具表面、基板或導線架保持緊密的接觸,而和模具接觸的地方會產生黏著的現象。而模具表面的粗糙度2.0~2.4之間,部分封膠材料黏性較高,故造成封膠模具在作業後,就必須花費時間來將模具進行脫模的程序,因為封膠材料殘留在模具表面的殘留物質不加以清除,勢必會影響到封膠過程中會產生一些失敗模式產生,例如:膠體剝離等,使得封裝良率大大的降低。本研究係針對半導體封裝製程中封膠製程中封膠材料對封裝模具減少沾黏提升模具作業時間做研究。本研究將針對封裝模具上鍍上不同材質的材料,再利用電子顯微鏡來分析表面粗糙度等,並作表面接觸角與離模測試,將所鍍膜材料與封膠離模效果作分析比較,另外也將針對不同的封裝條件,研究不同的作業參數對封膠模具黏著力的效果做最佳化的製程條件探討。 In general, molding compound residual can occur due to high temperature and high pressure in molding process, and this residual become hard to be removed when limit times of process, and mold chase cleaning is necessary. The main goal of this thesis is to solve the problem of molding compound residual by improving a surface coating on mold chase surface. We found that the roughness of the mold chase surface is around 2.0-2.4 um which can be smoothened by coating different material such as alumina, diamond, and SiO2. A SEM was used to analyze the surface structure of the mold chase, such as surface roughness, and surface contact angles and die testing performance analysis.
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