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封膠膠餅之收縮率對四邊扁平無接腳產品翹曲的研究 = The Study ...

劉賢民

封膠膠餅之收縮率對四邊扁平無接腳產品翹曲的研究 = The Study of Substrate Warpage in QFN Package due to Shrinkage Rate of Molding Compound

紀錄類型:	書目-語言資料,印刷品 : 單行本
並列題名:	The Study of Substrate Warpage in QFN Package due to Shrinkage Rate of Molding Compound
作者:	劉賢民,
其他團體作者:	國立高雄大學
出版地:	[高雄市]
出版者:	撰者;
出版年:	2015[民104]
面頁冊數:	75面圖，表 : 30公分;
標題:	基板翹曲
標題:	warpage of substrate
電子資源:	http://handle.ncl.edu.tw/11296/ndltd/84630968500632972867
附註:	104年10月31日公開
附註:	參考書目：面62-63
摘要註:	論文主要針對封膠膠餅收縮率與四側無引腳扁平構裝(Quad Flat Non-Leads Package; QFN)產品翹曲問題作深入探討,根據材料應力作用原理分別探討膠餅材料特性與翹曲變化相關性及封模模溫對翹曲影響關係,並針對已封膠完產品後製程加溫釋放構裝所造成內應力以改善翹曲不良率。由實驗結果發現膠餅特性中的固化收縮率CTE1、 CT2 是造成產品翹曲形態主要的因子,我們也發現封膠膠餅的填充物的濃度與固化收縮率成反比關係,可以改變封膠膠餅的填充物的濃度來解決翹曲問題,封膠膠溫度會影響膠餅固化縮收應力,也可以藉由改變封膠製程的溫度來解決翹曲問題,另外,在封膠熟化後也可以再利用後製程加溫一段時間來釋放內膠體與基板的介面應力使翹曲現象獲得明顯的改善。 This thesis is focused on the study of the warpage phenomenon in Quad Flat Non-Leads package (QFN). It is found that the formation of warpage (up or down) is due the stress force between molding compound and substrate, and it is an effective way to resolve the warpage by releasing this inner stress. By experiments, it is found that the shrinkage rate of molding compound is depended on the filler content in molding compound, and by modifying the filler content in molding compound it can improve the warpage problem. By doing processing optimization process control, it is found that molding temperature and cure shrinkage rate are correlated; the higher the molding temperature, the larger the shrinkage rate is. Therefore, by tuning the molding temperature can improve the warpage as well. In addition, by post annealing process which can marginally improve warpage by releasing the internal stress between molding compound and the substrate.

封膠膠餅之收縮率對四邊扁平無接腳產品翹曲的研究 = The Study of Substrate Warpage in QFN Package due to Shrinkage Rate of Molding Compound
劉, 賢民

封膠膠餅之收縮率對四邊扁平無接腳產品翹曲的研究 = The Study of Substrate Warpage in QFN Package due to Shrinkage Rate of Molding Compound / 劉賢民撰 - [高雄市] : 撰者, 2015[民104]. - 75面 ; 圖，表 ; 30公分.
104年10月31日公開參考書目：面62-63.
基板翹曲warpage of substrate

封膠膠餅之收縮率對四邊扁平無接腳產品翹曲的研究 = The Study of Substrate Warpage in QFN Package due to Shrinkage Rate of Molding Compound
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330 $a 論文主要針對封膠膠餅收縮率與四側無引腳扁平構裝(Quad Flat Non-Leads Package; QFN)產品翹曲問題作深入探討,根據材料應力作用原理分別探討膠餅材料特性與翹曲變化相關性及封模模溫對翹曲影響關係,並針對已封膠完產品後製程加溫釋放構裝所造成內應力以改善翹曲不良率。由實驗結果發現膠餅特性中的固化收縮率CTE1、 CT2 是造成產品翹曲形態主要的因子,我們也發現封膠膠餅的填充物的濃度與固化收縮率成反比關係,可以改變封膠膠餅的填充物的濃度來解決翹曲問題,封膠膠溫度會影響膠餅固化縮收應力,也可以藉由改變封膠製程的溫度來解決翹曲問題,另外,在封膠熟化後也可以再利用後製程加溫一段時間來釋放內膠體與基板的介面應力使翹曲現象獲得明顯的改善。 This thesis is focused on the study of the warpage phenomenon in Quad Flat Non-Leads package (QFN). It is found that the formation of warpage (up or down) is due the stress force between molding compound and substrate, and it is an effective way to resolve the warpage by releasing this inner stress. By experiments, it is found that the shrinkage rate of molding compound is depended on the filler content in molding compound, and by modifying the filler content in molding compound it can improve the warpage problem. By doing processing optimization process control, it is found that molding temperature and cure shrinkage rate are correlated; the higher the molding temperature, the larger the shrinkage rate is. Therefore, by tuning the molding temperature can improve the warpage as well. In addition, by post annealing process which can marginally improve warpage by releasing the internal stress between molding compound and the substrate.
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