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封裝材料電氣特性分析與主動電路研究電磁輻射干擾 = Electrical...

吳俞詠

封裝材料電氣特性分析與主動電路研究電磁輻射干擾 = Electrical Characteristics Analyzing of Package Material and Electromagnetic Interference Suppression Research with Active Circuit

Record Type:	Language materials, printed : monographic
Paralel Title:	Electrical Characteristics Analyzing of Package Material and Electromagnetic Interference Suppression Research with Active Circuit
Author:	吳俞詠,
Secondary Intellectual Responsibility:	國立高雄大學
Place of Publication:	[高雄市]
Published:	撰者;
Year of Publication:	2015[民104]
Description:	71面圖，表 : 30公分;
Subject:	微帶線
Subject:	Micro-strip
Online resource:	http://handle.ncl.edu.tw/11296/ndltd/08043682819107031550
Notes:	參考書目：面57-60
Summary:	電子產品高頻高速以及低功耗的趨勢下,使得材料隨頻率變化的穩定度和系統對電壓雜訊耐受度逐漸受到重視。電路設計之初,先確切掌握介電材料與頻率之間的關係能夠設計出符合實際規範的電路,避免電路操作時產生非預期響應;為降低功率消耗,設計者會採取低電壓方式,然而微量的電壓雜訊會令偏壓值變動進一步導致電路工作特性區域改變,因此電源完整性問題成為設計者首要解決的目標。本論文分為兩個部分,首先提出以微帶線的電氣特性進行介電材料隨頻率變化之參數萃取,透過微帶線上傳輸波長的變異及功率損耗推導萃取方法,以模擬與量測上的差異探討介電材料參數與頻率之間的關係。接著提出以反相器電路探討不同的BGA封裝結構下之共振模態及電磁輻射效應,設計不同電源配送網路以及封裝訊號路徑結構,透過近場掃瞄系統,完成分析不同的BGA封裝結構對於反相器電路在作動的狀態以及訊號結構之變異所產生的電磁輻射效應。 With high-frequency, high-speed circuit design and low power consumption of electronic products, the stability of dielectric material with frequency and the voltage noise margin are significant gradually. At the beginning of circuit design, when the relationship between dielectric material and frequency is obtained previously, the circuit design would meet the actual specifications to avoid circuit in the unintended effects. In order to reduce power consumption, the designer would take low voltage. But, such small amount of noise would make the bias voltage change. Moreover, the characteristics of circuit are changed. Therefore, power integrity issues become the primary solution designers target.This paper is divided into two parts. First, technology of electrical characteristics extraction by micro-strip is proposed. The wavelength variation of micro-strip and power consumption is derived extraction method. Second, the inverter chip is used to investigate EMI of different BGA package structures. With different power delivery network (PDN) and signal paths design, the situation of the inverter chip and EMI of different signal paths are analyzed completely by near-field scan system.

封裝材料電氣特性分析與主動電路研究電磁輻射干擾 = Electrical Characteristics Analyzing of Package Material and Electromagnetic Interference Suppression Research with Active Circuit
吳, 俞詠

封裝材料電氣特性分析與主動電路研究電磁輻射干擾 = Electrical Characteristics Analyzing of Package Material and Electromagnetic Interference Suppression Research with Active Circuit / 吳俞詠撰 - [高雄市] : 撰者, 2015[民104]. - 71面 ; 圖，表 ; 30公分.
參考書目：面57-60.
微帶線Micro-strip

封裝材料電氣特性分析與主動電路研究電磁輻射干擾 = Electrical Characteristics Analyzing of Package Material and Electromagnetic Interference Suppression Research with Active Circuit
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328 $a 碩士論文--國立高雄大學電機工程學系碩士班
330 $a 電子產品高頻高速以及低功耗的趨勢下,使得材料隨頻率變化的穩定度和系統對電壓雜訊耐受度逐漸受到重視。電路設計之初,先確切掌握介電材料與頻率之間的關係能夠設計出符合實際規範的電路,避免電路操作時產生非預期響應;為降低功率消耗,設計者會採取低電壓方式,然而微量的電壓雜訊會令偏壓值變動進一步導致電路工作特性區域改變,因此電源完整性問題成為設計者首要解決的目標。本論文分為兩個部分,首先提出以微帶線的電氣特性進行介電材料隨頻率變化之參數萃取,透過微帶線上傳輸波長的變異及功率損耗推導萃取方法,以模擬與量測上的差異探討介電材料參數與頻率之間的關係。接著提出以反相器電路探討不同的BGA封裝結構下之共振模態及電磁輻射效應,設計不同電源配送網路以及封裝訊號路徑結構,透過近場掃瞄系統,完成分析不同的BGA封裝結構對於反相器電路在作動的狀態以及訊號結構之變異所產生的電磁輻射效應。 With high-frequency, high-speed circuit design and low power consumption of electronic products, the stability of dielectric material with frequency and the voltage noise margin are significant gradually. At the beginning of circuit design, when the relationship between dielectric material and frequency is obtained previously, the circuit design would meet the actual specifications to avoid circuit in the unintended effects. In order to reduce power consumption, the designer would take low voltage. But, such small amount of noise would make the bias voltage change. Moreover, the characteristics of circuit are changed. Therefore, power integrity issues become the primary solution designers target.This paper is divided into two parts. First, technology of electrical characteristics extraction by micro-strip is proposed. The wavelength variation of micro-strip and power consumption is derived extraction method. Second, the inverter chip is used to investigate EMI of different BGA package structures. With different power delivery network (PDN) and signal paths design, the situation of the inverter chip and EMI of different signal paths are analyzed completely by near-field scan system.
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