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More than Moore technologies for next generation computer design
Record Type:
Electronic resources : Monograph/item
Title/Author:
More than Moore technologies for next generation computer designedited by Rasit O. Topaloglu.
other author:
Topaloglu, Rasit O.
Published:
New York, NY :Springer New York :2015.
Description:
ix, 218 p. :ill. (some col.), digital ;24 cm.
Contained By:
Springer eBooks
Subject:
Computer engineering.
Online resource:
http://dx.doi.org/10.1007/978-1-4939-2163-8
ISBN:
9781493921638 (electronic bk.)
More than Moore technologies for next generation computer design
More than Moore technologies for next generation computer design
[electronic resource] /edited by Rasit O. Topaloglu. - New York, NY :Springer New York :2015. - ix, 218 p. :ill. (some col.), digital ;24 cm.
Impact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration.
This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as "More than Moore" (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to "Moore's Law". Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
ISBN: 9781493921638 (electronic bk.)
Standard No.: 10.1007/978-1-4939-2163-8doiSubjects--Topical Terms:
212944
Computer engineering.
LC Class. No.: TK7885
Dewey Class. No.: 621.39
More than Moore technologies for next generation computer design
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Impact of TSV and Device Scaling on the Quality of 3D Ics -- 3D Integration Technology -- Design and Optimization of Spin-Transfer Torque MRAMs -- Embedded STT-MRAM: Device and Design -- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis -- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors -- Design Automation for On-chip Nanophotonic Integration.
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This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as "More than Moore" (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to "Moore's Law". Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
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Engineering (Springer-11647)
based on 0 review(s)
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EB TK7885 M835 2015
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http://dx.doi.org/10.1007/978-1-4939-2163-8
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