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Three-dimensional integration of sem...

Kada, Morihiro.

Three-dimensional integration of semiconductorsprocessing, materials, and applications /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Three-dimensional integration of semiconductorsedited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
Reminder of title:	processing, materials, and applications /
other author:	Kondo, Kazuo.
Published:	Cham :Springer International Publishing :2015.
Description:	xix, 408 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Semiconductors.
Online resource:	http://dx.doi.org/10.1007/978-3-319-18675-7
ISBN:	9783319186757$q(electronic bk.)

Three-dimensional integration of semiconductorsprocessing, materials, and applications /
Three-dimensional integration of semiconductorsprocessing, materials, and applications /[electronic resource] :edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi. - Cham :Springer International Publishing :2015. - xix, 408 p. :ill., digital ;24 cm.

Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

ISBN: 9783319186757$q(electronic bk.)

Standard No.: 10.1007/978-3-319-18675-7doiSubjects--Topical Terms:

182134
Semiconductors.

LC Class. No.: TK7874.893

Dewey Class. No.: 621.38152

Three-dimensional integration of semiconductorsprocessing, materials, and applications /
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245 0 0 $a Three-dimensional integration of semiconductors $h [electronic resource] : $b processing, materials, and applications / $c edited by Kazuo Kondo, Morihiro Kada, Kenji Takahashi.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2015.
300 $a xix, 408 p. : $b ill., digital ; $c 24 cm.
505 0 $a Research and Development History of Three Dimensional (3D) Integration Technology -- Recent Research and Development Activities of Three Dimensional (3D) Integration Technology -- TSV Processes -- Wafer and Die Bonding Processes -- Metrology and Inspection -- TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability -- Trends in 3D Integrated Circuit (3D-IC) Testing Technology -- Dream Chip Project at ASET.
520 $a This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
650 0 $a Semiconductors. $3 182134
650 0 $a Semiconductors $x Materials. $3 197826
650 1 4 $a Chemistry. $3 188628
650 2 4 $a Electrochemistry. $3 192934
650 2 4 $a Electrical Engineering. $3 338706
650 2 4 $a Mechanical Engineering. $3 273894
650 2 4 $a Biomedical Engineering. $3 190464
700 1 $a Kondo, Kazuo. $3 676840
700 1 $a Kada, Morihiro. $3 732554
700 1 $a Takahashi, Kenji. $3 732555
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856 4 0 $u http://dx.doi.org/10.1007/978-3-319-18675-7
950 $a Chemistry and Materials Science (Springer-11644)