國立高雄大學圖資館 |

Language: English

Back

Design for manufacturability with ad...

Pan, David Z.

Design for manufacturability with advanced lithography

Record Type:	Electronic resources : Monograph/item
Title/Author:	Design for manufacturability with advanced lithographyby Bei Yu, David Z. Pan.
Author:	Yu, Bei.
other author:	Pan, David Z.
Published:	Cham :Springer International Publishing :2016.
Description:	xi, 164 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Integrated circuitsDesign and construction.
Online resource:	http://dx.doi.org/10.1007/978-3-319-20385-0
ISBN:	9783319203850$q(electronic bk.)

Design for manufacturability with advanced lithography
Yu, Bei.

Design for manufacturability with advanced lithography[electronic resource] /by Bei Yu, David Z. Pan. - Cham :Springer International Publishing :2016. - xi, 164 p. :ill., digital ;24 cm.

Introduction -- Layout Decomposition for Triple Patterning -- Layout Decomposition for Other Patterning Techniques -- Standard Cell Compliance and Placement Co-Optimization -- Design for Manufacturability with E-Beam Lithography -- Conclusions and Future Works.

This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL) The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level, or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms. Enables readers to tackle the challenge of layout decompositions for different patterning techniques; Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design; Includes coverage of the design for manufacturability with E-Beam lithography.

ISBN: 9783319203850$q(electronic bk.)

Standard No.: 10.1007/978-3-319-20385-0doiSubjects--Topical Terms:

184690
Integrated circuits
--Design and construction.

LC Class. No.: TK7874

Dewey Class. No.: 621.3815

Design for manufacturability with advanced lithography
LDR:02115nmm a2200313 a 4500 001 481548
003 DE-He213
005 20160720151517.0
006 m d
007 cr nn 008maaau
008 161007s2016 gw s 0 eng d
020 $a 9783319203850$q(electronic bk.)
020 $a 9783319203843$q(paper)
024 7 $a 10.1007/978-3-319-20385-0 $2 doi
035 $a 978-3-319-20385-0
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
082 0 4 $a 621.3815 $2 23
090 $a TK7874 $b .Y94 2016
100 1 $a Yu, Bei. $3 737667
245 1 0 $a Design for manufacturability with advanced lithography $h [electronic resource] / $c by Bei Yu, David Z. Pan.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2016.
300 $a xi, 164 p. : $b ill., digital ; $c 24 cm.
505 0 $a Introduction -- Layout Decomposition for Triple Patterning -- Layout Decomposition for Other Patterning Techniques -- Standard Cell Compliance and Placement Co-Optimization -- Design for Manufacturability with E-Beam Lithography -- Conclusions and Future Works.
520 $a This book introduces readers to the most advanced research results on Design for Manufacturability (DFM) with multiple patterning lithography (MPL) and electron beam lithography (EBL) The authors describe in detail a set of algorithms/methodologies to resolve issues in modern design for manufacturability problems with advanced lithography. Unlike books that discuss DFM from the product level, or physical manufacturing level, this book describes DFM solutions from a circuit design level, such that most of the critical problems can be formulated and solved through combinatorial algorithms. Enables readers to tackle the challenge of layout decompositions for different patterning techniques; Presents a coherent framework, including standard cell compliance and detailed placement, to enable Triple Patterning Lithography (TPL) friendly design; Includes coverage of the design for manufacturability with E-Beam lithography.
650 0 $a Integrated circuits $x Design and construction. $3 184690
650 0 $a Photoresists. $3 737669
650 0 $a Lithography. $3 737670
650 1 4 $a Engineering. $3 210888
650 2 4 $a Circuits and Systems. $3 274416
650 2 4 $a Processor Architectures. $3 274498
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
700 1 $a Pan, David Z. $3 737668
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-20385-0
950 $a Engineering (Springer-11647)