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3D stacked chipsfrom emerging proces...

Elfadel, Ibrahim M.

3D stacked chipsfrom emerging processes to heterogeneous systems /

Record Type:	Electronic resources : Monograph/item
Title/Author:	3D stacked chipsedited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis.
Reminder of title:	from emerging processes to heterogeneous systems /
other author:	Elfadel, Ibrahim M.
Published:	Cham :Springer International Publishing :2016.
Description:	xxiii, 339 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Three-dimensional integrated circuits.
Online resource:	http://dx.doi.org/10.1007/978-3-319-20481-9
ISBN:	9783319204819$q(electronic bk.)

3D stacked chipsfrom emerging processes to heterogeneous systems /
3D stacked chipsfrom emerging processes to heterogeneous systems /[electronic resource] :edited by Ibrahim (Abe) M. Elfadel, Gerhard Fettweis. - Cham :Springer International Publishing :2016. - xxiii, 339 p. :ill. (some col.), digital ;24 cm.

Introduction to Electrical 3D Integration -- Copper-based TSV - Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.

ISBN: 9783319204819$q(electronic bk.)

Standard No.: 10.1007/978-3-319-20481-9doiSubjects--Topical Terms:

717043
Three-dimensional integrated circuits.

LC Class. No.: TK7874.893

Dewey Class. No.: 621.395

3D stacked chipsfrom emerging processes to heterogeneous systems /
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505 0 $a Introduction to Electrical 3D Integration -- Copper-based TSV - Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.
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