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Carbon nanotubes for interconnectspr...

Dijon, Jean.

Carbon nanotubes for interconnectsprocess, design and applications /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Carbon nanotubes for interconnectsedited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci.
Reminder of title:	process, design and applications /
other author:	Todri-Sanial, Aida.
Published:	Cham :Springer International Publishing :2017.
Description:	xii, 333 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Interconnects (Integrated circuit technology)
Online resource:	http://dx.doi.org/10.1007/978-3-319-29746-0
ISBN:	9783319297460$q(electronic bk.)

Carbon nanotubes for interconnectsprocess, design and applications /
Carbon nanotubes for interconnectsprocess, design and applications /[electronic resource] :edited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci. - Cham :Springer International Publishing :2017. - xii, 333 p. :ill. (some col.), digital ;24 cm.

Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes - Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.

This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs) This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.

ISBN: 9783319297460$q(electronic bk.)

Standard No.: 10.1007/978-3-319-29746-0doiSubjects--Topical Terms:

224341
Interconnects (Integrated circuit technology)

LC Class. No.: TK7874.53

Dewey Class. No.: 621.3815

Carbon nanotubes for interconnectsprocess, design and applications /
LDR:02931nmm a2200313 a 4500 001 504593
003 DE-He213
005 20160709092829.0
006 m d
007 cr nn 008maaau
008 171030s2017 gw s 0 eng d
020 $a 9783319297460$q(electronic bk.)
020 $a 9783319297446$q(paper)
024 7 $a 10.1007/978-3-319-29746-0 $2 doi
035 $a 978-3-319-29746-0
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7874.53
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
082 0 4 $a 621.3815 $2 23
090 $a TK7874.53 $b .C264 2017
245 0 0 $a Carbon nanotubes for interconnects $h [electronic resource] : $b process, design and applications / $c edited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2017.
300 $a xii, 333 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a Interconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes - Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs.
520 $a This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs) This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects.
650 0 $a Interconnects (Integrated circuit technology) $3 224341
650 0 $a Carbon nanotubes. $3 702609
650 1 4 $a Engineering. $3 210888
650 2 4 $a Circuits and Systems. $3 274416
650 2 4 $a Processor Architectures. $3 274498
650 2 4 $a Electronic Circuits and Devices. $3 495609
700 1 $a Todri-Sanial, Aida. $3 769454
700 1 $a Dijon, Jean. $3 769455
700 1 $a Maffucci, Antonio. $3 647481
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-29746-0
950 $a Engineering (Springer-11647)