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8th International Symposium on High-...
~
(1998 :)
8th International Symposium on High-Temperature Metallurgical Processing
Record Type:
Electronic resources : Monograph/item
Title/Author:
8th International Symposium on High-Temperature Metallurgical Processingedited by Jiann-Yang Hwang ... [et al.].
other author:
Hwang, Jiann-Yang.
corporate name:
Published:
Cham :Springer International Publishing :2017.
Description:
xxii, 818 p. :ill., digital ;24 cm.
Contained By:
Springer eBooks
Subject:
Materials at high temperaturesCongresses.
Online resource:
http://dx.doi.org/10.1007/978-3-319-51340-9
ISBN:
9783319513409$q(electronic bk.)
8th International Symposium on High-Temperature Metallurgical Processing
8th International Symposium on High-Temperature Metallurgical Processing
[electronic resource] /edited by Jiann-Yang Hwang ... [et al.]. - Cham :Springer International Publishing :2017. - xxii, 818 p. :ill., digital ;24 cm. - The minerals, metals & materials series,2367-1181. - Minerals, metals & materials series..
This collection features contributions covering the advances and developments of new high-temperature metallurgical technologies and their applications to the areas of: processing of minerals; extraction of metals; preparation of metallic, refractory, and ceramic materials; treatment and recycling of slag and wastes; conservation of energy; and environmental protection. The volume will have a broad impact on the academics and professionals serving the metallurgical industries around the world by providing them with comprehensive coverage of a wide variety of topics.
ISBN: 9783319513409$q(electronic bk.)
Standard No.: 10.1007/978-3-319-51340-9doiSubjects--Topical Terms:
666257
Materials at high temperatures
--Congresses.
LC Class. No.: TA417.7.H55
Dewey Class. No.: 620.11217
8th International Symposium on High-Temperature Metallurgical Processing
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based on 0 review(s)
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電子館藏
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1 records • Pages 1 •
1
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Attachments
000000138124
電子館藏
1圖書
電子書
EB TA417.7.H55 I61 2017
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0
1 records • Pages 1 •
1
Multimedia
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http://dx.doi.org/10.1007/978-3-319-51340-9
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