國立高雄大學圖資館 |

Language: English

Back

Foundations of heterogeneous integra...

SpringerLink (Online service)

Foundations of heterogeneous integrationan industry-based, 2.5D/3D pathfinding and co-design approach /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Foundations of heterogeneous integrationby Farhang Yazdani.
Reminder of title:	an industry-based, 2.5D/3D pathfinding and co-design approach /
Author:	Yazdani, Farhang.
Published:	Cham :Springer International Publishing :2018.
Description:	x, 177 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Engineering.
Online resource:	http://dx.doi.org/10.1007/978-3-319-75769-8
ISBN:	9783319757698$q(electronic bk.)

Foundations of heterogeneous integrationan industry-based, 2.5D/3D pathfinding and co-design approach /
Yazdani, Farhang.

Foundations of heterogeneous integrationan industry-based, 2.5D/3D pathfinding and co-design approach /[electronic resource] :by Farhang Yazdani. - Cham :Springer International Publishing :2018. - x, 177 p. :ill. (some col.), digital ;24 cm.

Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.

ISBN: 9783319757698$q(electronic bk.)

Standard No.: 10.1007/978-3-319-75769-8doiSubjects--Topical Terms:

210888
Engineering.

LC Class. No.: TK7888.4 / .Y393 2018

Dewey Class. No.: 620.11

Foundations of heterogeneous integrationan industry-based, 2.5D/3D pathfinding and co-design approach /
LDR:02415nmm a2200313 a 4500 001 533829
003 DE-He213
005 20180917091031.0
006 m d
007 cr nn 008maaau
008 181205s2018 gw s 0 eng d
020 $a 9783319757698$q(electronic bk.)
020 $a 9783319757674$q(paper)
024 7 $a 10.1007/978-3-319-75769-8 $2 doi
035 $a 978-3-319-75769-8
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7888.4 $b .Y393 2018
072 7 $a TJFC $2 bicssc
072 7 $a TEC008010 $2 bisacsh
082 0 4 $a 620.11 $2 23
090 $a TK7888.4 $b .Y35 2018
100 1 $a Yazdani, Farhang. $3 809684
245 1 0 $a Foundations of heterogeneous integration $h [electronic resource] : $b an industry-based, 2.5D/3D pathfinding and co-design approach / $c by Farhang Yazdani.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2018.
300 $a x, 177 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a Introduction -- Wirebond Physical Implementation -- Flip-Chip Physical Implementation -- Substrate Physical Implementation -- Conventional Design Flow -- Pathfinding and Co-Design.
520 $a This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively. Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level. Provides knowledge and skills necessary to design wirebond, flip chip and system in package (SIP) products; Provides practical solutions for 2.5D/3D memory and logic integration, explaining a complex, multidisciplinary topic in straightforward terms; Demonstrates a unique co-design methodology for optimizing cross domain heterogeneous integration, including examples, pathfinding, packaging strategy, interposer structure, etc.; Includes real, industry-based examples to give readers hands-on practical design experience.
650 0 $a Engineering. $3 210888
650 0 $a Electronic circuits. $3 182223
650 0 $a Electronics. $3 181966
650 0 $a Microelectronics. $3 182484
650 2 4 $a Circuits and Systems. $3 274416
650 2 4 $a Electronic Circuits and Devices. $3 495609
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-75769-8
950 $a Engineering (Springer-11647)