國立高雄大學圖資館 |

Language: English

Back

SiP system-in-package design and sim...

Li, Suny, (1974-)

SiP system-in-package design and simulationmentor EE flow advanced design guide /

Record Type:	Electronic resources : Monograph/item
Title/Author:	SiP system-in-package design and simulationSuny Li (Li Yang)
Reminder of title:	mentor EE flow advanced design guide /
Author:	Li, Suny,
Published:	Singapore ;John Wiley & Sons Singapore,2017.
Description:	1 online resource.
Subject:	Integrated circuitsDesign and construction.
Online resource:	https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991
ISBN:	9781119045991$q(electronic bk.)

SiP system-in-package design and simulationmentor EE flow advanced design guide /
Li, Suny,1974-

SiP system-in-package design and simulationmentor EE flow advanced design guide /[electronic resource] :Suny Li (Li Yang) - 1st ed. - Singapore ;John Wiley & Sons Singapore,2017. - 1 online resource.

Includes bibliographical references and index.

ISBN: 9781119045991$q(electronic bk.)

LCCN: 2017011202Subjects--Topical Terms:

184690
Integrated circuits
--Design and construction.

LC Class. No.: TK7874

Dewey Class. No.: 621.3815

SiP system-in-package design and simulationmentor EE flow advanced design guide /
LDR:01143cmm a2200301 a 4500 001 537148
005 20180302170832.0
006 m o d
007 cr |||||||||||
008 190111s2017 si ob 001 0 eng
010 $a 2017011202
020 $a 9781119045991$q(electronic bk.)
020 $a 1119045991$q(electronic bk.)
020 $a 9781119046011$q(Adobe PDF)
020 $a 1119046017$q(Adobe PDF)
020 $a 9781119046004$q(ePub)
020 $a 1119046009$q(ePub)
020 $z 9781119045939$q(cloth)
035 $a 002599232
040 $a DLC $b eng $c DLC $d OCLCF $d N $d DG1 $d IDEBK $d YDX $d UIU $d OCLCO $d RECBK $d OCLCQ $d UAB $d CNCGM $d UPM $d OCLCQ $d DEBSZ
050 0 0 $a TK7874
082 0 0 $a 621.3815 $2 23
100 1 $a Li, Suny, $q (Li Yang), $d 1974- $3 813831
245 1 0 $a SiP system-in-package design and simulation $h [electronic resource] : $b mentor EE flow advanced design guide / $c Suny Li (Li Yang)
250 $a 1st ed.
260 $a Singapore ; $a Hoboken, NJ : $b John Wiley & Sons Singapore, $c 2017.
300 $a 1 online resource.
504 $a Includes bibliographical references and index.
588 0 $a Print version record and CIP data provided by publisher.
650 0 $a Integrated circuits $x Design and construction. $3 184690
650 0 $a Multichip modules (Microelectronics) $x Design and construction. $3 185545
856 4 0 $u https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991