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3D IC and RF SiPsadvanced stacking a...

Horng, Tzyy-sheng Jason.

3D IC and RF SiPsadvanced stacking and planar solutions for 5G mobility /

Record Type:	Electronic resources : Monograph/item
Title/Author:	3D IC and RF SiPsLih-Tyng Hwang, Tzyy-Sheng Jason Horng.
Reminder of title:	advanced stacking and planar solutions for 5G mobility /
Author:	Hwang, Lih-Tyng.
other author:	Horng, Tzyy-sheng Jason.
Published:	Hoboken, NJ :John Wiley & Sons :2018.
Description:	1 online resource.
Subject:	Mobile communication systemsTechnological innovations.
Online resource:	https://onlinelibrary.wiley.com/doi/book/10.1002/9781119289654
ISBN:	9781119289654$q(electronic bk. ;$qoBook)

3D IC and RF SiPsadvanced stacking and planar solutions for 5G mobility /
Hwang, Lih-Tyng.

3D IC and RF SiPsadvanced stacking and planar solutions for 5G mobility /[electronic resource] :Lih-Tyng Hwang, Tzyy-Sheng Jason Horng. - 1st ed. - Hoboken, NJ :John Wiley & Sons :2018. - 1 online resource.

Includes bibliographical references and index.

Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index

ISBN: 9781119289654$q(electronic bk. ;$qoBook)

LCCN: 2018000679Subjects--Topical Terms:

582322
Mobile communication systems
--Technological innovations.

LC Class. No.: TK5103.2

Dewey Class. No.: 621.39/5

3D IC and RF SiPsadvanced stacking and planar solutions for 5G mobility /
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100 1 $a Hwang, Lih-Tyng. $3 814352
245 1 0 $a 3D IC and RF SiPs $h [electronic resource] : $b advanced stacking and planar solutions for 5G mobility / $c Lih-Tyng Hwang, Tzyy-Sheng Jason Horng.
250 $a 1st ed.
260 $a Hoboken, NJ : $b John Wiley & Sons : $b IEEE, $c 2018.
300 $a 1 online resource.
504 $a Includes bibliographical references and index.
505 0 $a Front Matter -- MM and MTM for Mobility -- Interconnects -- State-of-the-Art IC Packages, Modules, and Substrates -- Passives Technology -- Electrical Design for 5G Hardware-Digital Focus -- Electrical Design for 5G Hardware-RF Focus -- Product, Process Development, and Control -- Product Life and Reliability Assessment -- Hardware Solutions for 5G Mobility -- Appendices. A. Failure Mechanisms and Failure Analysis -- B. ANOVA -- C. Gauge R&R and DOE -- D. Statistics Tables -- Index
588 0 $a Print version record and CIP data provided by publisher; resource not viewed.
650 0 $a Mobile communication systems $x Technological innovations. $3 582322
700 1 $a Horng, Tzyy-sheng Jason. $3 814353
856 4 0 $u https://onlinelibrary.wiley.com/doi/book/10.1002/9781119289654