| Record Type: |
Language materials, printed
: monographic
|
| Author: |
林定皓, |
| Place of Publication: |
新北市 |
| Published: |
全華; |
| Year of Publication: |
2018[民107] |
| Edition: |
初版 |
| Description: |
1冊圖，表 : 26公分; |
| Series: |
輔助教材3 |
| Subject: |
電子工程 - |
| Subject: |
積體電路 - |
| Subject: |
半導體 - |
| Notes: |
封面英文題名：Electronic packaging technology introduction |
| Notes: |
含參考書目 |
| Notes: |
附錄:1.詞彙整理；2.典型構裝名稱外觀對照表 |
| [NT 15001349]: |
Electronic packaging technology introduction |
| ISBN: |
978-986-463-883-3 |