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Modeling and application of flexible...

Huang, YongAn.

Modeling and application of flexible electronics packaging

Record Type:	Electronic resources : Monograph/item
Title/Author:	Modeling and application of flexible electronics packagingby YongAn Huang, Zhouping Yin, Xiaodong Wan.
Author:	Huang, YongAn.
other author:	Yin, Zhouping.
Published:	Singapore :Springer Singapore :2019.
Description:	xvii, 287 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Flexible electronics.
Online resource:	https://doi.org/10.1007/978-981-13-3627-0
ISBN:	9789811336270$q(electronic bk.)

Modeling and application of flexible electronics packaging
Huang, YongAn.

Modeling and application of flexible electronics packaging[electronic resource] /by YongAn Huang, Zhouping Yin, Xiaodong Wan. - Singapore :Springer Singapore :2019. - xvii, 287 p. :ill., digital ;24 cm.

Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

ISBN: 9789811336270$q(electronic bk.)

Standard No.: 10.1007/978-981-13-3627-0doiSubjects--Topical Terms:

811670
Flexible electronics.

LC Class. No.: TK7872.F54 / H836 2019

Dewey Class. No.: 621.381

Modeling and application of flexible electronics packaging
LDR:01830nmm a2200325 a 4500 001 556792
003 DE-He213
005 20191004085555.0
006 m d
007 cr nn 008maaau
008 191127s2019 si s 0 eng d
020 $a 9789811336270$q(electronic bk.)
020 $a 9789811336263$q(paper)
024 7 $a 10.1007/978-981-13-3627-0 $2 doi
035 $a 978-981-13-3627-0
040 $a GP $c GP
041 0 $a eng
050 4 $a TK7872.F54 $b H836 2019
072 7 $a TJF $2 bicssc
072 7 $a TEC008000 $2 bisacsh
072 7 $a TJF $2 thema
082 0 4 $a 621.381 $2 23
090 $a TK7872.F54 $b H874 2019
100 1 $a Huang, YongAn. $3 790912
245 1 0 $a Modeling and application of flexible electronics packaging $h [electronic resource] / $c by YongAn Huang, Zhouping Yin, Xiaodong Wan.
260 $a Singapore : $b Springer Singapore : $b Imprint: Springer, $c 2019.
300 $a xvii, 287 p. : $b ill., digital ; $c 24 cm.
505 0 $a Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
520 $a This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
650 0 $a Flexible electronics. $3 811670
650 1 4 $a Electronics and Microelectronics, Instrumentation. $3 274412
650 2 4 $a Optical and Electronic Materials. $3 274099
650 2 4 $a Manufacturing, Machines, Tools, Processes. $3 833130
650 2 4 $a Theoretical and Applied Mechanics. $3 274501
650 2 4 $a Simulation and Modeling. $3 273719
700 1 $a Yin, Zhouping. $3 803505
700 1 $a Wan, Xiaodong. $3 839082
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer eBooks
856 4 0 $u https://doi.org/10.1007/978-981-13-3627-0
950 $a Engineering (Springer-11647)