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Si-RF technology

Karmakar, Ayan.

Si-RF technology

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Si-RF technologyby Ayan Karmakar, Kamaljeet Singh.
作者:	Karmakar, Ayan.
其他作者:	Singh, Kamaljeet.
出版者:	Singapore :Springer Singapore :2019.
面頁冊數:	xix, 144 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
標題:	Radio frequency integrated circuits.
電子資源:	https://doi.org/10.1007/978-981-13-8051-8
ISBN:	9789811380518$q(electronic bk.)

Si-RF technology
Karmakar, Ayan.

Si-RF technology[electronic resource] /by Ayan Karmakar, Kamaljeet Singh. - Singapore :Springer Singapore :2019. - xix, 144 p. :ill., digital ;24 cm.

Chapter 1: Silicon implementation of Planar Topologies -- Chapter-2: Fabrication technologies -- Chapter 3: Passive Circuits -- Chapter-4: Planar Antenna -- Chapter-5: MEMS Switch -- Chapter-6: Packaging concept in Radio Frequency -- Appendix-1: Material properties of some useful metals and dielectrics -- Appendix 2: Relaxation time estimation for some materials used in RF/microwave applications -- Appendix 3: Etch rate of various thin films of in wet and dry method -- Appendix 4: Readymade Chart for VSWR, Return Loss and Reflection Coefficient.

This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.

ISBN: 9789811380518$q(electronic bk.)

Standard No.: 10.1007/978-981-13-8051-8doiSubjects--Topical Terms:

224750
Radio frequency integrated circuits.

LC Class. No.: TK7874.78 / .K376 2019

Dewey Class. No.: 621.38412

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505 0 $a Chapter 1: Silicon implementation of Planar Topologies -- Chapter-2: Fabrication technologies -- Chapter 3: Passive Circuits -- Chapter-4: Planar Antenna -- Chapter-5: MEMS Switch -- Chapter-6: Packaging concept in Radio Frequency -- Appendix-1: Material properties of some useful metals and dielectrics -- Appendix 2: Relaxation time estimation for some materials used in RF/microwave applications -- Appendix 3: Etch rate of various thin films of in wet and dry method -- Appendix 4: Readymade Chart for VSWR, Return Loss and Reflection Coefficient.
520 $a This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
650 0 $a Radio frequency integrated circuits. $3 224750
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