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Transactions on engineering technolo...

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Transactions on engineering technologiesworld congress on engineering 2018 /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Transactions on engineering technologiesedited by Sio-Iong Ao, Len Gelman, Haeng Kon Kim.
Reminder of title:	world congress on engineering 2018 /
other author:	Ao, Sio-Iong.
corporate name:
Published:	Singapore :Springer Singapore :2019.
Description:	ix, 363 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Engineering
Online resource:	https://doi.org/10.1007/978-981-32-9531-5
ISBN:	9789813295315$q(electronic bk.)

Transactions on engineering technologiesworld congress on engineering 2018 /
Transactions on engineering technologiesworld congress on engineering 2018 /[electronic resource] :edited by Sio-Iong Ao, Len Gelman, Haeng Kon Kim. - Singapore :Springer Singapore :2019. - ix, 363 p. :ill., digital ;24 cm.

This volume contains a selection of revised and extended research articles written by prominent researchers participating in The 26th World Congress on Engineering (WCE 2018) which was held in London, U.K., July 4-6, 2018. Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state-of-the-art in engineering technologies and the physical sciences and their applications, and serves as a useful reference for researchers and graduate students working in these fields.

ISBN: 9789813295315$q(electronic bk.)

Standard No.: 10.1007/978-981-32-9531-5doiSubjects--Topical Terms:

252507
Engineering

LC Class. No.: TA5 / .W67 2018

Dewey Class. No.: 620

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520 $a This volume contains a selection of revised and extended research articles written by prominent researchers participating in The 26th World Congress on Engineering (WCE 2018) which was held in London, U.K., July 4-6, 2018. Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state-of-the-art in engineering technologies and the physical sciences and their applications, and serves as a useful reference for researchers and graduate students working in these fields.
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