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Power, thermal, noise, and signal in...
~
Gontrand, Christian,
Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
Record Type:
Language materials, printed : Monograph/item
Title/Author:
Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /Yue Ma and Christian Gontrand.
Author:
Ma, Yue
other author:
Gontrand, Christian,
Description:
xiii,226 p. : illustrations ; 24 cm
Subject:
Three-dimensional integrated circuits.
ISBN:
9780367023430
Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
Ma, Yue(Electronics engineer),
Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
Yue Ma and Christian Gontrand. - xiii,226 p. : illustrations ; 24 cm
ISBN: 9780367023430GBP$104.00
LCCN: 2018045497Subjects--Topical Terms:
717043
Three-dimensional integrated circuits.
LC Class. No.: TK7874.893 / .M33 2018
Dewey Class. No.: 621.3815/31
Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
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Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
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西方語文圖書區(四樓)
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1 records • Pages 1 •
1
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320000724601
西方語文圖書區(四樓)
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TK7874.893 M111 2018
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