Power, thermal, noise, and signal in...
Gontrand, Christian,

 

  • Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /
  • Record Type: Language materials, printed : Monograph/item
    Title/Author: Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement /Yue Ma and Christian Gontrand.
    Author: Ma, Yue
    other author: Gontrand, Christian,
    Description: xiii,226 p. : illustrations ; 24 cm
    Subject: Three-dimensional integrated circuits.
    ISBN: 9780367023430
Items
  • 1 records • Pages 1 •
 
320000724601 西方語文圖書區(四樓) 1圖書 一般圖書 TK7874.893 M111 2018 一般使用(Normal) On shelf 0
  • 1 records • Pages 1 •
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