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Circadian rhythms for future resilie...

Guo, Xinfei.

Circadian rhythms for future resilient electronic systemsaccelerated active self-healing for integrated circuits /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Circadian rhythms for future resilient electronic systemsby Xinfei Guo, Mircea R. Stan.
Reminder of title:	accelerated active self-healing for integrated circuits /
Author:	Guo, Xinfei.
other author:	Stan, Mircea R.
Published:	Cham :Springer International Publishing :2020.
Description:	xix, 208 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Integrated circuits.
Online resource:	https://doi.org/10.1007/978-3-030-20051-0
ISBN:	9783030200510$q(electronic bk.)

Circadian rhythms for future resilient electronic systemsaccelerated active self-healing for integrated circuits /
Guo, Xinfei.

Circadian rhythms for future resilient electronic systemsaccelerated active self-healing for integrated circuits /[electronic resource] :by Xinfei Guo, Mircea R. Stan. - Cham :Springer International Publishing :2020. - xix, 208 p. :ill., digital ;24 cm.

Introduction to Wearout -- Accelerated Self-Healing Techniques for BTI Wearout -- Accelerating and Activating Recovery for EM Wearout -- Circuit Techniques for Accelerated and Active Recovery -- Accelerated Self-Healing as a Key Design Knob for Cross-Layer Resilience -- Design and Aging Challenges in FinFET Circuits and Internet of Things (IoT) Applications -- Future Directions in Self-Healing.

This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.

ISBN: 9783030200510$q(electronic bk.)

Standard No.: 10.1007/978-3-030-20051-0doiSubjects--Topical Terms:

190434
Integrated circuits.

LC Class. No.: TK7888.4

Dewey Class. No.: 621.3815

Circadian rhythms for future resilient electronic systemsaccelerated active self-healing for integrated circuits /
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505 0 $a Introduction to Wearout -- Accelerated Self-Healing Techniques for BTI Wearout -- Accelerating and Activating Recovery for EM Wearout -- Circuit Techniques for Accelerated and Active Recovery -- Accelerated Self-Healing as a Key Design Knob for Cross-Layer Resilience -- Design and Aging Challenges in FinFET Circuits and Internet of Things (IoT) Applications -- Future Directions in Self-Healing.
520 $a This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.
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