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Advanced thermal stress analysis of ...

Akbarzadeh, Abdolhamid.

Advanced thermal stress analysis of smart materials and structures

Record Type:	Electronic resources : Monograph/item
Title/Author:	Advanced thermal stress analysis of smart materials and structuresby Zengtao Chen, Abdolhamid Akbarzadeh.
Author:	Chen, Zengtao.
other author:	Akbarzadeh, Abdolhamid.
Published:	Cham :Springer International Publishing :2020.
Description:	x, 304 p. :ill., digital ;24 cm.
Contained By:	Springer Nature eBook
Subject:	Smart materials.
Online resource:	https://doi.org/10.1007/978-3-030-25201-4
ISBN:	9783030252014$q(electronic bk.)

Advanced thermal stress analysis of smart materials and structures
Chen, Zengtao.

Advanced thermal stress analysis of smart materials and structures[electronic resource] /by Zengtao Chen, Abdolhamid Akbarzadeh. - Cham :Springer International Publishing :2020. - x, 304 p. :ill., digital ;24 cm. - Structural integrity,v.102522-560X ;. - Structural integrity ;v.1..

Heat conduction and moisture diffusion theories -- Basic Problems of Non-Fourier Heat Conduction -- Multiphysics of smart materials and structures -- Coupled thermal stresses in advanced and smart materials -- Thermal Fracture of Advanced Materials based on Fourier Heat Conduction -- Advanced thermal fracture analysis based on non-Fourier heat conduction models -- Future Perspectives.

This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.

ISBN: 9783030252014$q(electronic bk.)

Standard No.: 10.1007/978-3-030-25201-4doiSubjects--Topical Terms:

184739
Smart materials.

LC Class. No.: TA418.54 / .C44 2020

Dewey Class. No.: 620.11296

Advanced thermal stress analysis of smart materials and structures
LDR:03048nmm a2200337 a 4500 001 593049
003 DE-He213
005 20200706051621.0
006 m d
007 cr nn 008maaau
008 210727s2020 sz s 0 eng d
020 $a 9783030252014$q(electronic bk.)
020 $a 9783030252007$q(paper)
024 7 $a 10.1007/978-3-030-25201-4 $2 doi
035 $a 978-3-030-25201-4
040 $a GP $c GP
041 0 $a eng
050 4 $a TA418.54 $b .C44 2020
072 7 $a TGMD $2 bicssc
072 7 $a SCI096000 $2 bisacsh
072 7 $a TGMD $2 thema
082 0 4 $a 620.11296 $2 23
090 $a TA418.54 $b .C518 2020
100 1 $a Chen, Zengtao. $3 884302
245 1 0 $a Advanced thermal stress analysis of smart materials and structures $h [electronic resource] / $c by Zengtao Chen, Abdolhamid Akbarzadeh.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2020.
300 $a x, 304 p. : $b ill., digital ; $c 24 cm.
490 1 $a Structural integrity, $x 2522-560X ; $v v.10
505 0 $a Heat conduction and moisture diffusion theories -- Basic Problems of Non-Fourier Heat Conduction -- Multiphysics of smart materials and structures -- Coupled thermal stresses in advanced and smart materials -- Thermal Fracture of Advanced Materials based on Fourier Heat Conduction -- Advanced thermal fracture analysis based on non-Fourier heat conduction models -- Future Perspectives.
520 $a This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.
650 0 $a Smart materials. $3 184739
650 0 $a Smart structures. $3 184740
650 0 $a Thermal stresses. $3 276529
650 0 $a Materials $x Thermal conductivity. $3 884304
650 1 4 $a Solid Mechanics. $3 825700
650 2 4 $a Characterization and Evaluation of Materials. $3 273978
650 2 4 $a Mathematical Modeling and Industrial Mathematics. $3 274070
700 1 $a Akbarzadeh, Abdolhamid. $3 884303
710 2 $a SpringerLink (Online service) $3 273601
773 0 $t Springer Nature eBook
830 0 $a Structural integrity ; $v v.1. $3 802295
856 4 0 $u https://doi.org/10.1007/978-3-030-25201-4
950 $a Engineering (SpringerNature-11647)