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Transactions on engineering technolo...

Ao, Sio-Iong.

Transactions on engineering technologiesWorld Congress on Engineering 2019 /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Transactions on engineering technologiesedited by Sio-Iong Ao, Len Gelman, Haeng Kon Kim.
其他題名:	World Congress on Engineering 2019 /
其他作者:	Ao, Sio-Iong.
出版者:	Singapore :Springer Singapore :2021.
面頁冊數:	x, 247 p. :ill., digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	Engineering
電子資源:	https://doi.org/10.1007/978-981-15-8273-8
ISBN:	9789811582738$q(electronic bk.)

Transactions on engineering technologiesWorld Congress on Engineering 2019 /
Transactions on engineering technologiesWorld Congress on Engineering 2019 /[electronic resource] :edited by Sio-Iong Ao, Len Gelman, Haeng Kon Kim. - Singapore :Springer Singapore :2021. - x, 247 p. :ill., digital ;24 cm.

This book contains a selection of research articles written by prominent researchers participating in The 27th World Congress on Engineering (WCE 2019) which was held in London, UK, July 3-5, 2019. Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state of the art in engineering technologies and the physical sciences and their applications and serves as a useful reference for researchers and graduate students working in these fields.

ISBN: 9789811582738$q(electronic bk.)

Standard No.: 10.1007/978-981-15-8273-8doiSubjects--Topical Terms:

252507
Engineering

LC Class. No.: TA145 / .T73 2020

Dewey Class. No.: 620

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520 $a This book contains a selection of research articles written by prominent researchers participating in The 27th World Congress on Engineering (WCE 2019) which was held in London, UK, July 3-5, 2019. Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state of the art in engineering technologies and the physical sciences and their applications and serves as a useful reference for researchers and graduate students working in these fields.
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