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Design and crosstalk analysis in car...

Mallick, Partha Sharathi.

Design and crosstalk analysis in carbon nanotube interconnects

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Design and crosstalk analysis in carbon nanotube interconnectsby P. Uma Sathyakam, Partha Sharathi Mallick.
作者:	Sathyakam, P. Uma.
其他作者:	Mallick, Partha Sharathi.
出版者:	Singapore :Springer Singapore :2021.
面頁冊數:	xiii, 134 p. :ill., digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	Interconnects (Integrated circuit technology)
電子資源:	https://doi.org/10.1007/978-981-15-8888-4
ISBN:	9789811588884$q(electronic bk.)

Design and crosstalk analysis in carbon nanotube interconnects
Sathyakam, P. Uma.

Design and crosstalk analysis in carbon nanotube interconnects[electronic resource] /by P. Uma Sathyakam, Partha Sharathi Mallick. - Singapore :Springer Singapore :2021. - xiii, 134 p. :ill., digital ;24 cm.

Introduction -- Background and Literature Review -- Reducing Crosstalk in CNT Interconnects -- Reducing Crosstalk using Ultra-low-k Dielectrics in CNT Interconnects -- Reducing Crosstalk using Air-gaps -- Thermal Analysis of CNT Interconnects -- Modelling of High Speed CNT Interconnects under Subthreshold Conditions -- Conclusions and Future Work.

This book provides a single-source reference on carbon nanotubes for interconnect applications. It presents the recent advances in modelling and challenges of carbon nanotube (CNT)-based VLSI interconnects. Starting with a background of carbon nanotubes and interconnects, this book details various aspects of CNT interconnect models, the design metrics of CNT interconnects, crosstalk analysis of recently proposed CNT interconnect structures, and geometries. Various topics covered include the use of semiconducting CNTs around metallic CNTs, CNT interconnects with air gaps, use of emerging ultra low-k materials and their integration with CNT interconnects, and geometry-based crosstalk reduction techniques. This book will be useful for researchers and design engineers working on carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

ISBN: 9789811588884$q(electronic bk.)

Standard No.: 10.1007/978-981-15-8888-4doiSubjects--Topical Terms:

224341
Interconnects (Integrated circuit technology)

LC Class. No.: TK7874.53 / .S37 2021

Dewey Class. No.: 621.3815

Design and crosstalk analysis in carbon nanotube interconnects
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