國立高雄大學圖資館 |

Language: English

Back

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /

Record Type:	Language materials, printed : Monograph/item
Title/Author:	Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /Xing-Chang Wei.
Author:	Wei, Xing-Chang,
Published:	Boca Raton :CRC Press, Taylor & Francis Group,c2017.
Description:	xviii, 322 p. :ill. ;24 cm.
Notes:	First issued in paperback 2020.
Subject:	Electromagnetic compatibility.
ISBN:	9780367573669 (pbk.) :

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
Wei, Xing-Chang,

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /Xing-Chang Wei. - Boca Raton :CRC Press, Taylor & Francis Group,c2017. - xviii, 322 p. :ill. ;24 cm.

First issued in paperback 2020.

Includes bibliographical references and index.

ISBN: 9780367573669 (pbk.) :NT$1354

LCCN: 2016053999Subjects--Topical Terms:

184298
Electromagnetic compatibility.

LC Class. No.: TK7868.P7 / W44 2017

Dewey Class. No.: 621.3815/31

Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /
LDR:00735cam a2200217 a 450 001 616544
005 20170726132912.0
008 220920s2017 flua b 001 0 eng
010 $a 2016053999
020 $a 9780367573669 (pbk.) : $c NT$1354
020 $a 9781138033566
020 $z 9781315305875 (ebook)
035 $a 559915
040 $a DLC $b eng $c DLC $d DLC
042 $a pcc
050 0 0 $a TK7868.P7 $b W44 2017
082 0 0 $a 621.3815/31 $2 23
100 1 $a Wei, Xing-Chang, $e author. $3 915973
245 1 0 $a Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging / $c Xing-Chang Wei.
260 $a Boca Raton : $b CRC Press, Taylor & Francis Group, $c c2017.
300 $a xviii, 322 p. : $b ill. ; $c 24 cm.
500 $a First issued in paperback 2020.
504 $a Includes bibliographical references and index.
650 0 $a Electromagnetic compatibility. $3 184298
650 0 $a Electronic packaging. $3 182161
650 0 $a Printed circuits $x Design and construction. $3 225904