| 紀錄類型: |
書目-語言資料,印刷品
: Monograph/item
|
| 正題名/作者: |
Modeling and design of electromagnetic compatibility for high-speed printed circuit boards and packaging /Xing-Chang Wei. |
| 作者: |
Wei, Xing-Chang, |
| 出版者: |
Boca Raton :CRC Press, Taylor & Francis Group,c2017. |
| 面頁冊數: |
xviii, 322 p. :ill. ;24 cm. |
| 附註: |
First issued in paperback 2020. |
| 標題: |
Electromagnetic compatibility. |
| ISBN: |
9780367573669 (pbk.) : |