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MicroSystem based on SiP technology

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	MicroSystem based on SiP technologyedited by Suny Li.
其他作者:	Li, Suny.
出版者:	Singapore :Springer Nature Singapore :2022.
面頁冊數:	xviii, 874 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	Integrated circuitsDesign and construction.
電子資源:	https://doi.org/10.1007/978-981-19-0083-9
ISBN:	9789811900839$q(electronic bk.)

MicroSystem based on SiP technology
MicroSystem based on SiP technology[electronic resource] /edited by Suny Li. - Singapore :Springer Nature Singapore :2022. - xviii, 874 p. :ill. (some col.), digital ;24 cm.

From Moore's law to Function Density Law -- From SiP to Si3P -- SiP Technology and MicroSystem -- From 2D to 4D Integration -- SiP and Advanced Packaging Technology -- SiP Design, Simulation and Verification Platform -- Establishment and Management of Central Library -- SiP Schematic Design Input -- Creation and Setting of Layout -- Management of Design Rules -- Wire Bonding Design in Detail -- Cavity, Chip Stack and TSV design -- RDL and Flip Chip Design -- Layout Route and Plane -- Embedded Passive Design -- RF Circuit Design -- Rigid-Flex Circuits and 4D SiP Design -- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) -- Design Review and Production Data Output -- SiP Simulation and Verification Technology -- Large Capacity Storage SiP Design Case -- SiP Project Planning and Design Case -- 2.5D TSV Technology and Design Case -- Digital T/R Module SiP Design Case -- MEMS Verification SiP Design Case -- Rigid-Flex SiP Design Case -- RF System Integrated SiP Design Case -- PoP RF SiP Design Case -- SiP Production Data Processing Case.

This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.

ISBN: 9789811900839$q(electronic bk.)

Standard No.: 10.1007/978-981-19-0083-9doiSubjects--Topical Terms:

184690
Integrated circuits
--Design and construction.

LC Class. No.: TK7874 / .M53 2022

Dewey Class. No.: 621.3815

MicroSystem based on SiP technology
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505 0 $a From Moore's law to Function Density Law -- From SiP to Si3P -- SiP Technology and MicroSystem -- From 2D to 4D Integration -- SiP and Advanced Packaging Technology -- SiP Design, Simulation and Verification Platform -- Establishment and Management of Central Library -- SiP Schematic Design Input -- Creation and Setting of Layout -- Management of Design Rules -- Wire Bonding Design in Detail -- Cavity, Chip Stack and TSV design -- RDL and Flip Chip Design -- Layout Route and Plane -- Embedded Passive Design -- RF Circuit Design -- Rigid-Flex Circuits and 4D SiP Design -- Multi-Layout Project and Concurrent DesignSiP Design Flow Based on Advanced Package (HDAP) -- Design Review and Production Data Output -- SiP Simulation and Verification Technology -- Large Capacity Storage SiP Design Case -- SiP Project Planning and Design Case -- 2.5D TSV Technology and Design Case -- Digital T/R Module SiP Design Case -- MEMS Verification SiP Design Case -- Rigid-Flex SiP Design Case -- RF System Integrated SiP Design Case -- PoP RF SiP Design Case -- SiP Production Data Processing Case.
520 $a This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si³P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
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700 1 $a Li, Suny. $3 922206
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