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More-than-moore devices and integration for semiconductors

Record Type:	Electronic resources : Monograph/item
Title/Author:	More-than-moore devices and integration for semiconductorsedited by Francesca Iacopi, Francis Balestra.
other author:	Iacopi, F.
Published:	Cham :Springer International Publishing :2023.
Description:	xiv, 260 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer Nature eBook
Subject:	Electronics.
Online resource:	https://doi.org/10.1007/978-3-031-21610-7
ISBN:	9783031216107$q(electronic bk.)

More-than-moore devices and integration for semiconductors
More-than-moore devices and integration for semiconductors[electronic resource] /edited by Francesca Iacopi, Francis Balestra. - Cham :Springer International Publishing :2023. - xiv, 260 p. :ill. (some col.), digital ;24 cm.

Introduction -- TSV and interposers -- Interconnects, including optical -- Simulations and reliability -- Sensors and cameras -- Integrated power sources -- Energy harvesters and power management -- Flexible and wearable electronics -- Photonics and/ or Antennas with metamaterials -- Neuromorphic computing for IoT -- Brain-computer interfaces.

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

ISBN: 9783031216107$q(electronic bk.)

Standard No.: 10.1007/978-3-031-21610-7doiSubjects--Topical Terms:

181966
Electronics.

LC Class. No.: TK7835 / .M67 2023

Dewey Class. No.: 621.3815

More-than-moore devices and integration for semiconductors
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300 $a xiv, 260 p. : $b ill. (some col.), digital ; $c 24 cm.
505 0 $a Introduction -- TSV and interposers -- Interconnects, including optical -- Simulations and reliability -- Sensors and cameras -- Integrated power sources -- Energy harvesters and power management -- Flexible and wearable electronics -- Photonics and/ or Antennas with metamaterials -- Neuromorphic computing for IoT -- Brain-computer interfaces.
520 $a This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
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650 0 $a Semiconductors. $3 182134
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