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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2022, 14-15 September, Langkawi, Malaysia /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposiumedited by Mohd Arif Anuar Mohd Salleh ... [et al.].
其他題名:	EPITS 2022, 14-15 September, Langkawi, Malaysia /
其他題名:	EPITS 2022
其他作者:	Mohd Salleh, Mohd Arif Anuar.
團體作者:
出版者:	Singapore :Springer Nature Singapore :2023.
面頁冊數:	xli, 875 p. :ill. (some col.), digital ;24 cm.
Contained By:	Springer Nature eBook
標題:	Electronic packagingHandbooks, manuals, etc.
電子資源:	https://doi.org/10.1007/978-981-19-9267-4
ISBN:	9789811992674$q(electronic bk.)

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2022, 14-15 September, Langkawi, Malaysia /
Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2022, 14-15 September, Langkawi, Malaysia /[electronic resource] :EPITS 2022edited by Mohd Arif Anuar Mohd Salleh ... [et al.]. - Singapore :Springer Nature Singapore :2023. - xli, 875 p. :ill. (some col.), digital ;24 cm. - Springer proceedings in physics,v. 2891867-4941 ;. - Springer proceedings in physics,v. 289..

Green Materials and Electronic Packaging Interconnect Technology -- Electronic Materials and Technology -- Green Materials and Technology.

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.

ISBN: 9789811992674$q(electronic bk.)

Standard No.: 10.1007/978-981-19-9267-4doiSubjects--Topical Terms:

435082
Electronic packaging
--Handbooks, manuals, etc.

LC Class. No.: TK7870.15

Dewey Class. No.: 621.381046

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology SymposiumEPITS 2022, 14-15 September, Langkawi, Malaysia /
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