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Silicon semiconductor technologyprocessing and integration of microelectronic devices /

Record Type:	Electronic resources : Monograph/item
Title/Author:	Silicon semiconductor technologyby Ulrich Hilleringmann.
Reminder of title:	processing and integration of microelectronic devices /
Author:	Hilleringmann, Ulrich.
Published:	Wiesbaden :Springer Fachmedien Wiesbaden :2023.
Description:	xi, 264 p. :ill., digital ;24 cm.
Contained By:	Springer Nature eBook
Subject:	SemiconductorsMaterials.
Online resource:	https://doi.org/10.1007/978-3-658-41041-4
ISBN:	9783658410414$q(electronic bk.)

Silicon semiconductor technologyprocessing and integration of microelectronic devices /
Hilleringmann, Ulrich.

Silicon semiconductor technologyprocessing and integration of microelectronic devices /[electronic resource] :by Ulrich Hilleringmann. - Wiesbaden :Springer Fachmedien Wiesbaden :2023. - xi, 264 p. :ill., digital ;24 cm.

Wafer fabrication -- Thermal oxidation -- Lithography -- Etching technology -- Doping techniques -- Chemical and Physical Deposition -- Metallization and Contacts.

The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view. The Content Wafer fabrication Thermal oxidation Lithography Etching technology Doping techniques Chemical and Physical Deposition Metallization and Contacts About the Author Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.

ISBN: 9783658410414$q(electronic bk.)

Standard No.: 10.1007/978-3-658-41041-4doiSubjects--Topical Terms:

197826
Semiconductors
--Materials.

LC Class. No.: TK7871.85

Dewey Class. No.: 621.38152

Silicon semiconductor technologyprocessing and integration of microelectronic devices /
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520 $a The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view. The Content Wafer fabrication Thermal oxidation Lithography Etching technology Doping techniques Chemical and Physical Deposition Metallization and Contacts About the Author Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.
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