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Advanced liquid metal cooling for chip, device and system

Record Type:	Electronic resources : Monograph/item
Title/Author:	Advanced liquid metal cooling for chip, device and systemJing Liu.
Author:	Liu, Jing,
Published:	Singapore ;World Scientific,c2022.
Description:	1 online resource :ill.
Subject:	Electronic apparatus and appliancesCooling.
Online resource:	https://www.worldscientific.com/worldscibooks/10.1142/12517#t=toc
ISBN:	9789811245862$q(ebook)

Advanced liquid metal cooling for chip, device and system
Liu, Jing,1969-

Advanced liquid metal cooling for chip, device and system[electronic resource] /Jing Liu. - 1st ed. - Singapore ;World Scientific,c2022. - 1 online resource :ill.

Includes bibliographical references and index.

"This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry"--

ISBN: 9789811245862$q(ebook)

LCCN: 2021046877Subjects--Topical Terms:

782171
Electronic apparatus and appliances
--Cooling.

LC Class. No.: TK7870.25 / .L48 2022

Dewey Class. No.: 621.381

Advanced liquid metal cooling for chip, device and system
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100 1 $a Liu, Jing, $d 1969- $3 976660
245 1 0 $a Advanced liquid metal cooling for chip, device and system $h [electronic resource] / $c Jing Liu.
250 $a 1st ed.
260 $a Singapore ; $a Hackensack, NJ : $b World Scientific, $c c2022.
300 $a 1 online resource : $b ill.
504 $a Includes bibliographical references and index.
520 $a "This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry"-- $c Provided by publisher.
588 $a Description based on print version record.
650 0 $a Electronic apparatus and appliances $x Cooling. $3 782171
650 0 $a Liquid metal heat transfer. $3 976661
650 0 $a Liquid metals $x Thermal properties. $3 976662
650 0 $a Thermofluids. $3 917404
650 0 $a Heat exchangers. $3 190351
856 4 0 $u https://www.worldscientific.com/worldscibooks/10.1142/12517#t=toc